Chip package
An integrated fan-out package including an integrated circuit, a plurality of memory devices, an insulating encapsulation, and a redistribution circuit structure is provided. The memory devices are electrically connected to the integrated circuit. The integrated circuit and the memory devices are stacked, and the memory devices are embedded in the insulating encapsulation. The redistribution circuit structure is disposed on the insulating encapsulation, and the redistribution circuit structure is electrically connected to the integrated circuit and the memory devices. Furthermore, methods for fabricating the integrated fan-out package are also provided.
1. A chip package, comprising:
an integrated circuit chip comprising an active surface;
at least one memory chip disposed on the active surface of the integrated circuit chip and electrically connected to the integrated circuit chip;
an insulating encapsulation, laterally encapsulating the at least one memory chip and partially covering the active surface of the integrated circuit chip; and
a redistribution circuit structure disposed on the at least one memory chip and the insulating encapsulation, the redistribution circuit structure being electrically connected to the integrated circuit chip and the at least one memory chip.
2. The chip package as claimed in claim 1 , wherein the integrated circuit chip further comprises a rear surface opposite to the active surface of the integrated circuit chip, and the integrated circuit chip is electrically connected to the at least one memory chip through bumps.
3. The chip package as claimed in claim 1 further comprising conductive pillars penetrating through the insulating encapsulation, wherein the integrated circuit chip is electrically connected to the redistribution circuit structure through conductive pillars.
4. The chip package as claimed in claim 1 , wherein at least one memory chip and the insulating encapsulation are disposed between the integrated circuit chip and the redistribution circuit structure.
5. The chip package as claimed in claim 1 further comprising a controller disposed between the at least one memory chip and the redistribution circuit structure, wherein the controller and the at least one memory chip are laterally encapsulated by the insulating encapsulation, and the controller is electrically connected to the integrated circuit chip.
6. The chip package as claimed in claim 5 , wherein the at least one memory chip is electrically connected to the controller through bumps.
7. The chip package as claimed in claim 1 further comprising:
conductive terminals electrically connected to the redistribution circuit structure, wherein the redistribution circuit structure is between the conductive terminals and the at least one memory chip.
8. The chip package as claimed in claim 7 further comprising:
a package circuit substrate, wherein the redistribution circuit structure is electrically connected to the package circuit substrate through the conductive terminals.
9. A chip package, comprising:
an integrated circuit chip comprising an active surface and a rear surface opposite to the active surface;
memory chips disposed over the rear surface of the integrated circuit chip, wherein the memory chips are electrically connected to the integrated circuit chip;
an insulating encapsulation laterally encapsulating the integrated circuit chip and the memory chips; and
a redistribution circuit structure disposed on the active surface of the integrated circuit chip and a surface of the insulating encapsulation, and the redistribution circuit structure being electrically connected to the integrated circuit chip and the memory chips.
10. The chip package as claimed in claim 9 , wherein the integrated circuit chip is between the redistribution circuit structure and the memory chips.
11. The chip package as claimed in claim 9 , wherein a second insulating portion of the insulating encapsulation partially covers the rear surface of the integrated circuit chip and a first insulating portion of the insulating encapsulation.
12. The chip package as claimed in claim 11 further comprising:
a plurality of conductive pillars penetrating through the first insulating portion of the insulating encapsulation, the memory chips being electrically connected to the redistribution circuit structure through the conductive pillars; and
a redistribution layer on surfaces of the memory chips, wherein the integrated circuit chip is electrically connected to the memory chips through the redistribution circuit structure, the plurality of conductive pillars and the redistribution layer.
13. The chip package as claimed in claim 9 further comprising:
a plurality of conductive terminals electrically connected to the redistribution circuit structure, wherein the redistribution circuit structure is between the conductive terminals and the integrated circuit chip.
14. The chip package as claimed in claim 13 further comprising:
a package circuit substrate, wherein the redistribution circuit structure is electrically connected to the package circuit substrate through the conductive terminals.
15. A chip package, comprising:
an integrated circuit chip comprising an active surface and a rear surface opposite to the active surface;
memory chips disposed over the active surface of the integrated circuit chip, wherein the memory chips are electrically connected to the integrated circuit chip;
an insulating encapsulation laterally encapsulating the integrated circuit chip and the memory chips, the memory chips being disposed over a first insulating portion of the insulating encapsulation; and
a redistribution circuit structure disposed on the rear surface of the integrated circuit chip and a surface of the insulating encapsulation, and the redistribution circuit structure being electrically connected to the integrated circuit chip and the memory chips.
16. The chip package as claimed in claim 15 , wherein the integrated circuit chip is disposed between the redistribution circuit structure and the memory chips.
17. The chip package as claimed in claim 15 further comprising:
conductive terminals electrically connected to the redistribution circuit structure, wherein the redistribution circuit structure is between the conductive terminals and the integrated circuit chip.
18. The chip package as claimed in claim 17 further comprising:
a package circuit substrate, wherein the redistribution circuit structure is electrically connected to the package circuit substrate through the conductive terminals.
19. The chip package as claimed in claim 15 , wherein a second insulating portion of the insulating encapsulation partially covers the active surface of the integrated circuit chip and a first insulating portion of the insulating encapsulation.
20. The chip package as claimed in claim 19 further comprising:
conductive pillars penetrating through the first insulating portion of the insulating encapsulation, the memory chips being electrically connected to the redistribution circuit structure through the conductive pillars; and
a redistribution layer on surfaces of the memory chips, wherein the integrated circuit chip is electrically connected to the memory chips through the redistribution circuit structure, the conductive pillars and the redistribution layer.