IC structure with single active region having different doping profile than set of active regions
An integrated circuit (IC) structure with a single active region having a doping profile different than that of a set of active regions, is disclosed. The IC structure provides a single active region, e.g., a fin, on a substrate with a first doping profile, and a set of active regions, e.g., fins, electrically isolated from the single active region on the substrate. The set of active regions have a second doping profile that is different than the first doping profile of the single active region. For example, the second doping profile can have a deeper penetration into the substrate than the first doping profile.
1. An integrated circuit (IC) structure, comprising:
a single active region on a substrate, the single active region having a first doping profile; and
a set of active regions electrically isolated from the single active region on the substrate,
wherein the set of active regions have a second doping profile that is different than the first doping profile of the single active region,
wherein the second doping profile of the set of active regions is deeper in the substrate and has a higher dopant concentration than the first doping profile of the single active region, and
wherein the first doping profile and the second doping profile have coplanar upper surfaces.
2. The IC structure of claim 1 , wherein a region of the second doping profile that extends deeper than the first doping profile into the substrate has a higher dopant concentration than a region of the substrate below the first doping profile of the single active.
3. The IC structure of claim 1 , wherein the set of active regions includes a plurality of semiconductor fins.
4. The IC structure of claim 1 , wherein the single active region includes a single semiconductor fin.
5. The IC structure of claim 1 , wherein a dopant of the first and second doping profiles is an n-type dopant.
6. The IC structure of claim 1 , wherein the set of active regions have a first spacing therebetween, and the single active region has a second spacing from an outermost, adjacent active region of the set of active regions that is at least twice that of the first spacing.
7. The IC structure of claim 1 , further comprising a trench isolation between the set of active regions and the single active region.
8. The IC structure of claim 1 , wherein the set of active regions and the single active region are portions of a selected semiconductor fin separated by a pair of diffusion breaks in the selected semiconductor fin.
9. An integrated circuit (IC) structure, comprising:
a single semiconductor fin on a substrate, the single semiconductor fin having a first n-type doping profile; and
a set of semiconductor fins electrically isolated from the single semiconductor fin on the substrate, the set of semiconductor fins having a second n-type doping profile,
wherein the second n-type doping profile of the set of semiconductor fins has a greater depth in the substrate than the first n-type doping profile of the single semiconductor fin,
wherein the second n-type doping profile of the set of semiconductor fins is deeper in the substrate and has a higher dopant concentration than the first n-type doping profile of the single semiconductor fin, and
wherein the first n-type doping profile and the second n-type doping profile have coplanar upper surfaces.
10. The IC structure of claim 9 , wherein a region of the second n-type doping profile that extends deeper than the first n-type doping profile into the substrate has a higher dopant concentration than a region of the substrate below the first n-type doping profile of the single semiconductor fin.
11. The IC structure of claim 9 , wherein the set of semiconductor fins have a first spacing therebetween, and the single semiconductor fin has a second spacing from an outermost, adjacent semiconductor fin of the set of semiconductor fins that is at least twice that of the first spacing.
12. The IC structure of claim 9 , further comprising a trench isolation between the set of semiconductor fins and the single semiconductor fin.
13. A method of forming an integrated circuit (IC) structure, the method comprising:
forming a set of active regions on a substrate, and a single active region electrically isolated from the set of active regions on the substrate;
first doping the set of active regions and the single active region, creating a first doping profile in the set of active regions and the single active region;
masking the single active region, leaving the set of active regions exposed; and
second doping the set of active regions, creating a second doping profile in the set of active regions that is different than the first doping profile of the single active region,
wherein the second doping profile of the set of active regions is deeper in the substrate and has a higher dopant concentration than the first doping profile of the single active region, and
wherein the first doping profile and the second doping profile have coplanar upper surfaces.
14. The method of claim 13 , wherein a region of the second doping profile that extends deeper than the first doping profile into the substrate has a higher dopant concentration than a region of the substrate below the first doping profile of the single active region.
15. The method of claim 13 , wherein the set of active regions includes a plurality of semiconductor fins, and the single active region includes a single semiconductor fin.
16. The method of claim 13 , wherein forming the set of active regions and the single active region includes forming the set of active regions have a first spacing therebetween, and the single active region having a second spacing from an outermost, adjacent active region of the set of active regions that is at least twice that of the first spacing.
17. The method of claim 13 , wherein forming the set of active regions and the single active region includes forming a pair of diffusion breaks in a selected semiconductor fin, the set of active regions and the single active region being portions of the selected semiconductor fin separated by the pair of diffusion breaks in the selected semiconductor fin.