Semiconductor device
A semiconductor device includes a gate electrode, a gate insulating film which includes oxidized material containing silicon and covers the gate electrode, an oxide semiconductor film provided to be in contact with the gate insulating film and overlap with at least the gate electrode, and a source electrode and a drain electrode electrically connected to the oxide semiconductor film. In the oxide semiconductor film, a first region which is provided to be in contact with the gate insulating film and have a thickness less than or equal to 5 nm has a silicon concentration lower than or equal to 1.0 at. %, and a region in the oxide semiconductor film other than the first region has lower silicon concentration than the first region. At least the first region includes a crystal portion.
1. A semiconductor device comprising:
a gate electrode;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film; and
a source electrode and a drain electrode electrically connected to the oxide semiconductor film,
wherein the gate electrode comprises at least one of molybdenum, titanium, tantalum, tungsten, aluminum, copper, neodymium, and scandium,
wherein the oxide semiconductor film comprises indium, gallium and zinc,
wherein the oxide semiconductor film comprises a region having crystallinity,
wherein a concentration of silicon in the region having crystallinity is higher than 0 at. % and lower than or equal to 1.0 at. %,
wherein a concentration of carbon in the region having crystallinity is higher than 0 at. % and lower than or equal to 1.0×10 20 atoms/cm 3 , and
wherein the region having crystallinity comprises microcrystal.
2. A semiconductor device comprising:
a gate electrode;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film; and
a source electrode and a drain electrode electrically connected to the oxide semiconductor film,
wherein the oxide semiconductor film comprises indium, gallium, zinc, silicon and carbon,
wherein the oxide semiconductor film comprises a region having crystallinity,
wherein the oxide semiconductor film comprises a first region in contact with the gate insulating film and a second region over the first region,
wherein a concentration of silicon in the second region is lower than a concentration of silicon in the first region, and
wherein a concentration of carbon in the oxide semiconductor film is lower than or equal to 1.0×10 20 atoms/cm 3 .
3. A semiconductor device comprising:
a gate electrode;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film; and
a source electrode and a drain electrode electrically connected to the oxide semiconductor film,
wherein the oxide semiconductor film comprises indium, gallium, zinc, silicon and carbon,
wherein the oxide semiconductor film comprises a region having crystallinity,
wherein a concentration of silicon in the region having crystallinity is lower than or equal to 1.0 at.%,
wherein a concentration of carbon in the region having crystallinity is lower than or equal to 1.0×10 20 atoms/cm 3 , and
wherein the region having crystallinity comprises microcrystal.
4. A semiconductor device comprising:
a gate electrode;
a gate insulating film over the gate electrode;
an oxide semiconductor film over the gate insulating film; and
a source electrode and a drain electrode electrically connected to the oxide semiconductor film,
wherein the oxide semiconductor film comprises indium, gallium, zinc, silicon and carbon,
wherein the oxide semiconductor film comprises a region having crystallinity, and
wherein a concentration of carbon in the region having crystallinity is lower than or equal to 1.0×10 20 atoms/cm 3 .