Integrated piezoresistive and piezoelectric fusion force sensor
Described herein is a ruggedized microelectromechanical (“MEMS”) force sensor including both piezoresistive and piezoelectric sensing elements and integrated with complementary metal-oxide-semiconductor (“CMOS”) circuitry on the same chip. The sensor employs piezoresistive strain gauges for static force and piezoelectric strain gauges for dynamic changes in force. Both piezoresistive and piezoelectric sensing elements are electrically connected to integrated circuits provided on the same substrate as the sensing elements. The integrated circuits can be configured to amplify, digitize, calibrate, store, and/or communicate force values electrical terminals to external circuitry.
1. A microelectromechanical (“MEMS”) force sensor, comprising:
a sensor die configured to receive an applied force, wherein the sensor die comprises a top surface and a bottom surface opposite thereto,
a piezoresistive sensing element arranged on the bottom surface of the sensor die, wherein the piezoresistive sensing element is configured to convert a strain to a first analog electrical signal that is proportional to the strain,
a piezoelectric sensing element arranged on the bottom surface of the sensor die, wherein the piezoelectric sensing element is configured to convert a change in strain to a second analog electrical signal that is proportional to the change in strain, and
digital circuitry arranged on the bottom surface of the sensor die, wherein the digital circuitry is configured to convert the first and second analog electrical signals to respective digital electrical output signals.
2. The MEMS force sensor of claim 1 , wherein the piezoresistive sensing element is formed by diffusion or implantation.
3. The MEMS force sensor of claim 1 , wherein the piezoresistive sensing element is formed by polysilicon processes from an integrated circuit process.
4. The MEMS force sensor of claim 1 , further comprising a solder ball arranged on the bottom surface of the sensor die, wherein the piezoelectric sensing element is disposed between the solder ball and the sensor die.
5. The MEMS force sensor of claim 1 , further comprising a plurality of electrical terminals arranged on the bottom surface of the sensor die, wherein the respective digital electrical output signals produced by the digital circuitry are routed to the electrical terminals.
6. The MEMS force sensor of claim 5 , wherein the electrical terminals comprise solder bumps or copper pillars.
7. The MEMS force sensor of claim 1 , wherein the digital circuitry is further configured to use the second analog electrical signal produced by the piezoelectric sensing element and the first analog electrical signal produced by the piezoresistive sensing element in conjunction to improve sensitivity and accuracy.
8. The MEMS force sensor of claim 7 , wherein the first analog electrical signal produced by the piezoresistive sensing element measures static force applied to the MEMS force sensor.
9. The MEMS force sensor of claim 7 , wherein the second analog electrical signal produced by the piezoelectric sensing element measures dynamic force applied to the MEMS force sensor.
10. The MEMS force sensor of claim 1 , further comprising a cap attached to the sensor die at a surface defined by an outer wall of the sensor die, wherein a sealed cavity is formed between the cap and the sensor die.
11. The MEMS force sensor of claim 10 , wherein the sensor die comprises a flexure formed therein, and wherein the flexure converts the applied force into the strain on the bottom surface of the sensor die.
12. The MEMS force sensor of claim 11 , wherein the flexure is formed in the sensor die by etching.
13. The MEMS force sensor of claim 10 , wherein a gap is arranged between the sensor die and the cap, and wherein the gap is configured to narrow with application of the applied force such that the flexure is unable to deform beyond its breaking point.
14. The MEMS force sensor of claim 1 , further comprising an inter-metal dielectric layer arranged on the bottom surface of the sensor die.
15. The MEMS force sensor of claim 14 , wherein the piezoelectric sensing element is arranged on the inter-metal dielectric layer.
16. The MEMS force sensor of claim 1 , wherein the digital circuitry is further configured to store the respective digital electrical output signals to a buffer.
17. The MEMS force sensor of claim 16 , wherein the digital circuitry comprises the buffer.