Semiconductor device and method of manufacturing the same
A semiconductor device includes first and second active patterns on a substrate, the first and second active patterns adjacent to each other in a first direction with a first trench between the first and second active patterns, third and fourth active patterns on the substrate, the third and fourth active patterns adjacent to each other in the first direction with a second trench between the third and fourth active patterns. The semiconductor device includes a first device isolation layer in the first trench, and a second device isolation layer in the second trench. A width of the second trench in the first direction is greater than a width of the first trench in the first direction. The second device isolation layer includes a first protrusion and a second protrusion which protrude from a top surface of the second device isolation layer.
1. A semiconductor device comprising:
a first active pattern and a second active pattern on a substrate, the first and second active patterns adjacent to each other in a first direction with a first trench between the first and second active patterns;
a third active pattern and a fourth active pattern on the substrate, the third and fourth active patterns adjacent to each other in the first direction with a second trench between the third and fourth active patterns;
a first device isolation layer in the first trench; and
a second device isolation layer in the second trench,
wherein a width of the second trench in the first direction is greater than a width of the first trench in the first direction,
wherein the second device isolation layer comprises a first protrusion and a second protrusion which protrude from a top surface of the second device isolation layer, and
wherein the first protrusion and the second protrusion are spaced apart from the third and fourth active patterns.
2. The semiconductor device of claim 1 , wherein a distance between the third active pattern and the first protrusion is substantially equal to a distance between the fourth active pattern and the second protrusion.
3. The semiconductor device of claim 1 , wherein an aspect ratio of the first device isolation layer ranges from 25 to 100.
4. The semiconductor device of claim 1 , wherein an aspect ratio of the second device isolation layer ranges from 1 to 20.
5. The semiconductor device of claim 1 , wherein a width of each of the third and fourth active patterns in the first direction is greater than a width of each of the first and second active patterns in the first direction.
6. The semiconductor device of claim 1 , further comprising:
source/drain patterns provided in upper portions of the first to fourth active patterns; and
a gate electrode intersecting the first to fourth active patterns.
7. The semiconductor device of claim 6 , wherein the upper portions of the first to fourth active patterns protrude from the first and second device isolation layers in a direction perpendicular to the substrate.
8. The semiconductor device of claim 6 ,
wherein each of the first to fourth active patterns comprises a channel pattern comprising semiconductor patterns that are vertically stacked, and
wherein the gate electrode is on a top surface, a bottom surface and both sidewalls of each of the semiconductor patterns.
9. A semiconductor device comprising:
a substrate comprising an active region;
a device isolation layer on the substrate that defines active patterns on the active region, wherein the active patterns are spaced apart in a first direction;
source/drain patterns in upper portions of the active patterns;
gate electrodes intersecting the active patterns and extending in the first direction, wherein the gate electrodes are in a second direction intersecting the first direction; and
an interlayer insulating layer overlapping the source/drain patterns and the gate electrodes,
wherein the active patterns comprise a first active pattern and a second active pattern adjacent to each other in the first direction, and a third active pattern and a fourth active pattern adjacent to each other in the first direction,
wherein the device isolation layer comprises a first device isolation layer between the first and second active patterns, and a second device isolation layer between the third and fourth active patterns,
wherein a width of the second device isolation layer in the first direction is greater than a width of the first device isolation layer in the first direction,
wherein the second device isolation layer comprises a first protrusion and a second protrusion which protrude from a top surface of the second device isolation layer, and
wherein the first protrusion and the second protrusion are spaced apart from the third and fourth active patterns.
10. The semiconductor device of claim 9 , wherein the active region is a PMOSFET region or an NMOSFET region.
11. The semiconductor device of claim 9 , wherein a distance between the third active pattern and the first protrusion is substantially equal to a distance between the fourth active pattern and the second protrusion.
12. The semiconductor device of claim 9 , wherein an aspect ratio of the first device isolation layer ranges from 25 to 100.
13. The semiconductor device of claim 9 , wherein an aspect ratio of the second device isolation layer ranges from 1 to 20.
14. The semiconductor device of claim 9 , wherein a width of each of the third and fourth active patterns in the first direction is greater than a width of each of the first and second active patterns in the first direction.
15. A semiconductor device comprising:
a first active pattern and a second active pattern on a substrate with a first trench therebetween;
a third active pattern and a fourth active pattern on the substrate, with a second trench therebetween;
a first device isolation layer in the first trench;
a second device isolation layer in the second trench;
a plurality of semiconductor patterns that are vertically stacked on the active patterns; and
a gate electrode overlapping the active patterns, the first trench and the second trench and extending between ones of the plurality of semiconductor patterns,
wherein a first distance between the first active pattern and the second active pattern is less than a second distance between the third active pattern and the fourth active pattern,
wherein the second device isolation layer comprises a first protrusion and a second protrusion which protrude from a top surface of the second device isolation layer,
wherein the first protrusion and the second protrusion are spaced apart from the third and fourth active patterns.
16. The semiconductor device of claim 15 ,
wherein the first protrusion and the second protrusion protrude into the gate electrode.
17. The semiconductor device of claim 15 , further comprising:
a gate dielectric pattern on top surfaces of the first protrusion and the second protrusion, overlapping the second device isolation layer.
18. The semiconductor device of claim 15 ,
wherein a distance between the third active pattern and the first protrusion is substantially equal to a distance between the fourth active pattern and the second protrusion.
19. The semiconductor device of claim 15 ,
wherein an aspect ratio of the first device isolation layer ranges from 25 to 100.
20. The semiconductor device of claim 15 ,
wherein an aspect ratio of the second device isolation layer ranges from 1 to 20.