IP Library › Granted Patent US 11,289,344
Granted Patent B2
US 11,289,344 · App. 16/518,481 · Granted Mar 29, 2022

Heat treatment method and heat treatment apparatus for managing dummy wafer

Inventors: Tomohiro Ueno (Kyoto, JP); Kazuhiko Fuse (Kyoto, JP); Mao Omori (Kyoto, JP)
Assignee: SCREEN HOLDINGS CO., LTD.
H01L21/46H01L21/67098
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Quick Facts
Patent No.
US 11,289,344
App. No.
16/518,481
Granted
Mar 29, 2022
Kind
B2
Abstract

When a carrier storing a plurality of dummy wafers therein is transported into a heat treatment apparatus, the carrier is registered as a dummy carrier exclusive to the dummy wafers. A dummy database in which a treatment history of each of the dummy wafers is associated with the carrier is held in a storage part. The treatment history of each of the dummy wafers registered in the dummy database is displayed on a display part of the heat treatment apparatus. An operator of the heat treatment apparatus views the displayed information to thereby appropriately grasp and manage the treatment history of each of the dummy wafers.

Claims (12)

1. A method of managing a dummy wafer stored in a carrier for a heat treatment process, said method comprising the steps of:

(a) transporting a carrier storing a plurality of dummy wafers therein into a heat treatment apparatus;

(b) registering said carrier in a dummy wafer database as a dummy carrier exclusive to the dummy wafers, wherein the dummy wafer database stores (1) identification information of the carrier and (2) a treatment history of each of the dummy wafers in the carrier, the treatment history is associated with the identification information, and the treatment history includes information on how many times preheating is performed on each dummy wafer and how many times flash heating is performed on each dummy wafer;

(c) performing the preheating using a continuous lighting lamp and the flash heating using a flash lamp on each of the dummy wafers of the carrier;

(d) each time the preheating and the flash heating are performed on each of the dummy wafers, updating the treatment history of each of said dummy wafers so that the treatment history indicates that (1) how many times each of the dummy wafers in the carrier is subjected to the preheating, and (2) how many times each of the dummy wafers in the carrier is subjected to the flash heating; and

(e) displaying the treatment history of each of said dummy wafers in the carrier to provide information about when to replace each of the dummy wafers.

2. A heat treatment apparatus for managing a dummy wafer stored in a carrier, comprising:

a receiving part for receiving a carrier storing a plurality of dummy wafers therein;

a registration part for registering in a dummy wafer database said carrier transported into said receiving part as a dummy carrier exclusive to the dummy wafers, wherein the dummy wafer database stores (1) identification information of the carrier and (2) a treatment history of each of the dummy wafers in the carrier, the treatment history is associated with the identification information, and the treatment history includes information on how many times preheating is performed on each dummy wafer and how many times flash heating is performed on each dummy wafer;

a heating part including a continuous lighting lamp and a flash lamp, wherein the preheating using the continuous lighting lamp and the flash heating using the flash lamp are respectively performed on each of the dummy wafers of the carrier;

a storage part for updating, each time the preheating and the flash heating are performed on each of the dummy wafers, the treatment history of each of said dummy wafers so that the treatment history indicates that (1) how many times each of the dummy wafers in the carrier is subjected to the preheating, and (2) how many times each of the dummy wafers in the carrier is subjected to the flash heating; and

a display part for displaying the treatment history of each of said dummy wafers in the carrier to provide information about when to replace each of the dummy wafers.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 24, 2019
From: UENO, TOMOHIRO; FUSE, KAZUHIKO; OMORI, MAO
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 049843/0306 →
Priority Claims (1)
JP JP2018-171392 · Sep 13, 2018 · national
Continuity (1)
Related Publication 20200090949A1 · Mar 19, 2020