Substrate processing method, substrate processing device and etching liquid

1. A substrate processing method, comprising:

holding a substrate; and

supplying an etching liquid to the substrate held in the holding of the substrate, the etching liquid containing an etching agent configured to etch a metal-based first material and a silicon-based second material exposed on the substrate and a protection agent configured to react with the silicon-based second material between the metal-based first material and the silicon-based second material to form a protection layer on a surface of the silicon-based second material, the etching agent being a liquid which contains fluorine atoms and an organic solvent and substantially does not contain water, and the protection layer protecting the silicon-based second material from etching with the etching agent, and

separating the organic solvent from a used etching liquid serving as the etching liquid in the supplying of the etching liquid,

wherein the separating of the organic solvent includes:

discharging the used etching liquid to a first drain line configured to discharge a processing liquid; and

vaporizing the organic solvent contained in the used etching liquid by heating the used etching liquid flowing through the first drain line.

2. The substrate processing method of claim 1 ,

wherein the protection agent is a silylating agent.

3. The substrate processing method of claim 1 ,

wherein the protection agent has a direct bond between a silicon atom and a nitrogen atom.

4. The substrate processing method of claim 3 ,

wherein the protection agent is represented by a following Chemical Formula 1:

and

R 1 to R 5 each independently represent an alkyl group substituted with a halogen or an unsubstituted alkyl group.

5. The substrate processing method of claim 3 ,

wherein the protection agent is represented by a following Chemical Formula 2:

and

R 6 to R 12 each independently represent an alkyl group or a hydrogen atom.

6. The substrate processing method of claim 3 ,

wherein the protection agent is represented by a following Chemical Formula 3:

and

R 13 to R 19 each independently represent an alkyl group.

7. The substrate processing method of claim 1 ,

wherein the first drain line is configured to discharge the processing liquid other than an organic processing liquid,

wherein the separating of the organic solvent further includes:

discharging the organic solvent, which is vaporized in the vaporizing of the organic solvent, to a second drain line through a connection line configured to connect the second drain line configured to discharge the organic processing liquid and the first drain line.

8. The substrate processing method of claim 7 ,

wherein a boiling point of the organic solvent is lower than a boiling point of water, and

in the vaporizing of the organic solvent, the used etching liquid is heated to a temperature lower than the boiling point of the water and higher than the boiling point of the organic solvent.

9. The substrate processing method of claim 7 ,

wherein the discharging of the organic solvent includes:

liquefying the organic solvent, which is vaporized in the vaporizing of the organic solvent, in the connection line.

10. The substrate processing method of claim 7 , further comprising:

dissolving and discharging a salt containing the fluorine atoms and remaining in the first drain line by allowing a cleaning liquid configured to dissolve the salt to flow into the first drain line.

11. The substrate processing method of claim 1 ,

wherein the separating of the organic solvent includes:

discharging the used etching liquid to a first drain line configured to discharge a processing liquid other than an organic processing liquid and storing the used etching liquid in a reservoir provided at a portion of the first drain line;

vaporizing the organic solvent contained in the used etching liquid by heating the used etching liquid stored in the reservoir; and

discharging the organic solvent, which is vaporized in the vaporizing of the organic solvent, to a second drain line through a connection line configured to connect the second drain line configured to discharge the organic processing liquid and the reservoir.

12. The substrate processing method of claim 1 ,

wherein the etching agent is generated by dissolving a salt containing the fluorine atoms in the organic solvent.