IP Library Granted Patent US 11,316,481
Granted Patent B2
US 11,316,481 · App. 16/939,831 · Granted Apr 26, 2022

RF power transistor circuit

Inventors: Hussain H. Ladhani (Tempe, AZ); Gerard J. Bouisse (Toulouse, FR); Jeffrey K. Jones (Chandler, AZ)
Assignee: NXP USA, Inc.
H03F1/3205H03F1/0211H03F1/0288H03F1/3247H03F1/42H03F1/565H03F3/193H03F3/21H03F3/211H03F3/265H03F3/04H03F2200/225H03F2200/391H03F2200/451H03F2203/21106
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Quick Facts
Patent No.
US 11,316,481
App. No.
16/939,831
Granted
Apr 26, 2022
Kind
B2
Abstract

A radio frequency (RF) power transistor circuit includes a power transistor and a decoupling circuit. The power transistor has a control electrode coupled to an input terminal for receiving an RF input signal, a first current electrode for providing an RF output signal at an output terminal, and a second current electrode coupled to a voltage reference. The decoupling circuit includes a first inductive element, a first resistor, and a first capacitor coupled together in series between the first current electrode of the power transistor and the voltage reference. The decoupling circuit is for dampening a resonance at a frequency lower than an RF frequency.

Claims (39)

1. A radio frequency (RF) power transistor circuit comprising:

a power transistor having a control electrode for receiving a RF input signal, and a current electrode for providing a RF output signal;

a node coupled to the current electrode of the power transistor;

a decoupling circuit coupled between the node and a ground terminal, wherein the decoupling circuit comprises a first inductive element, a resistor, and a first capacitor coupled together in series between the node and the ground terminal;

a second inductive element with a first end coupled to the current electrode and a second end coupled to the node; and

a D.C. blocking capacitor coupled in parallel with the decoupling circuit between the node and the ground terminal.

2. The RF power transistor circuit of claim 1 , wherein the first inductive element and the first capacitor form an inductor/capacitor circuit that has a resonance at a frequency below a passband range of frequencies for the RF power transistor circuit, and the resistor is configured to dampen the resonance of the inductor/capacitor circuit.

3. The RF power transistor circuit of claim 2 , wherein the decoupling circuit presents a high impedance path to RF signals within the passband range of frequencies.

4. The RF power transistor circuit of claim 2 , wherein the passband range of frequencies is between 1.6 gigahertz and 3.7 gigahertz.

5. The RF power transistor circuit of claim 1 , further comprising:

a D.C. voltage pin coupled to the current electrode for providing a power supply voltage to the power transistor circuit.

6. The RF power transistor circuit of claim 5 , further comprising:

a third inductive element coupled between the D.C. voltage pin and the node, wherein a parallel inductance is formed by the second and third inductive elements.

7. The RF power transistor circuit of claim 5 , further comprising:

an output terminal coupled to the current electrode, wherein the D.C. voltage pin is coupled to the output terminal.

8. A radio frequency (RF) power transistor circuit comprising:

a power transistor having a control electrode for receiving a RF input signal, and a current electrode for providing a RF output signal;

a node coupled to the current electrode of the power transistor;

a decoupling circuit coupled between the node and a ground terminal, wherein the decoupling circuit comprises a first inductive element, a resistor, and a first capacitor coupled together in series between the node and the ground terminal;

a D.C. blocking capacitor coupled in parallel with the decoupling circuit between the node and the ground terminal; and

a second capacitor, wherein the resistor and the first inductive element are coupled in series between second and third nodes, and the second capacitor is coupled between the second and third nodes in parallel with the resistor and the first inductive element.

9. The RF power transistor circuit of claim 1 , further comprising:

an output terminal; and

a third inductive element coupled between the current electrode of the power transistor and the output terminal.

10. The RF power transistor circuit of claim 1 , wherein the decoupling circuit provides a low frequency termination to ground for distortion products that develop due to envelope frequencies.

11. The RF power transistor circuit of claim 10 , wherein the resonance is 20 megahertz or less.

12. The RF power transistor circuit of claim 1 , further comprising:

an input terminal coupled to the control terminal of the power transistor, wherein the input terminal is configured to receive the RF input signal; and

a D.C. voltage pin coupled to the control terminal for receiving a bias voltage.

13. The RF power transistor circuit of claim 1 , further comprising:

a second decoupling circuit comprising a third inductive element, a second resistor, and a second capacitor coupled together in series between the control electrode of the power transistor and the ground terminal.

14. A radio frequency (RF) power transistor circuit comprising:

a power transistor having a control electrode for receiving a RF input signal, and a current electrode for providing a RF output signal;

a node coupled to the current electrode of the power transistor;

a decoupling circuit coupled between the node and a ground terminal, wherein the decoupling circuit comprises a first inductive element, a resistor, and a first capacitor coupled together in series between the node and the ground terminal;

a D.C. blocking capacitor coupled in parallel with the decoupling circuit between the node and the ground terminal; and

a second decoupling circuit comprising a second inductive element, a second resistor, and a second capacitor coupled together in series between the control electrode of the power transistor and the ground terminal,

wherein the first inductive element and the first capacitor form a first inductor/capacitor circuit that has a first resonance at a frequency below a passband range of frequencies for the RF power transistor circuit, and the resistor is configured to dampen the first resonance of the first inductor/capacitor circuit, and

wherein the second inductive element and the second capacitor form a second inductor/capacitor circuit that has a second resonance at a frequency below the passband range of frequencies for the RF power transistor circuit, and the second resistor is configured to dampen the second resonance of the second inductor/capacitor circuit.

Assignments (4)
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE FROM NXP U INC. TO FREESCALE SEMICONDUCTOR, INC.. PREVIOUSLY RECORDED AT REEL: 058559 FRAME: 0097. ASSIGNOR(S) HEREBY CONFIRMS THE ASIGNMENT. Recorded Jan 11, 2022
From: BOUISSE, GERARD J
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 059167/0401 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 5, 2022
From: BOUISSE, GERARD J.
To: INC., NXP U
Reel/Frame 058559/0097 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 27, 2020
From: LADHANI, HUSSAIN H.; JONES, JEFFREY K.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 053320/0432 →
MERGER AND CHANGE OF NAME Recorded Jul 27, 2020
From: FREESCALE SEMICONDUCTOR, INC.; NXP USA, INC.
To: NXP USA, INC.
Reel/Frame 053323/0788 →
Continuity (6)
Continuation 16255612 · Jan 23, 2019
Continuation 15674261 · Aug 10, 2017
Continuation 14942419 · Nov 16, 2015
Continuation 14185382 · Feb 20, 2014
Continuation 12746793
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