IP Library Granted Patent US 11,348,791
Granted Patent B2
US 11,348,791 · App. 16/884,291 · Granted May 31, 2022

Bonding apparatus and bonding method

Inventors: Toshifumi Inamasu (Koshi, JP); Shinichi Shinozuka (Koshi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/187B23P19/10B23P21/00B23Q17/22B23Q17/24B23Q17/2428H01L21/67121Y10T29/5317
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Quick Facts
Patent No.
US 11,348,791
App. No.
16/884,291
Granted
May 31, 2022
Kind
B2
Abstract

A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

Claims (11)

1. A bonding apparatus configured to bond a first substrate and a second substrate, comprising:

a first holder configured to hold the first substrate;

a second holder configured to hold the second substrate;

a first imaging device provided at the first holder and configured to image the second substrate held by the second holder;

a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged by the first imaging device;

a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and

a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged by the second imaging device,

wherein each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.

2. The bonding apparatus of claim 1 ,

wherein each of the first light irradiating device and the second light irradiating device is further connected to a second light source configured to irradiate light other than the white light, and

the first light irradiating device and the second light irradiating device are allowed to switch irradiation of the light from the first light source and irradiation of the light from the second light source.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 3, 2020
From: INAMASU, TOSHIFUMI; SHINOZUKA, SHINICHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 052823/0922 →
Priority Claims (1)
JP JP2019-099179 · May 28, 2019 · national
Continuity (1)
Related Publication 20200381255A1 · Dec 3, 2020
Cited By (1)
US 12,381,083