Bonding apparatus and bonding method
A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder configured to hold the second substrate; a first imaging device provided at the first holder and configured to image the second substrate held by the second holder; a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged; a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged. Each of the first light irradiating device and the second light irradiating device is connected to a first light source configured to irradiate white light.
1. A bonding apparatus configured to bond a first substrate and a second substrate, comprising:
a first holder configured to hold the first substrate;
a second holder configured to hold the second substrate;
a first imaging device provided at the first holder and configured to image the second substrate held by the second holder;
a first light irradiating device provided at the first holder and configured to irradiate light to the second substrate when the second substrate is imaged by the first imaging device;
a second imaging device provided at the second holder and configured to image the first substrate held by the first holder; and
a second light irradiating device provided at the second holder and configured to irradiate light to the first substrate when the first substrate is imaged by the second imaging device,
wherein first light sources for irradiating white light are provided independently and respectively for the first light irradiating device and the second light irradiating device.
2. The bonding apparatus of claim 1 ,
wherein the first light sources are LEDs.
3. The bonding apparatus of claim 1 ,
wherein the white light is synthesized by emitting lights of a plurality of colors all at once.
4. The bonding apparatus of claim 2 ,
wherein the white light is synthesized by emitting lights of a plurality of colors all at once.
5. The bonding apparatus of claim 3 ,
wherein the plurality of colors includes red, green and blue.
6. The bonding apparatus of claim 4 ,
wherein the plurality of colors includes red, green and blue.
7. The bonding apparatus of claim 1 ,
wherein the white light has a wavelength band ranging from about 430 nm to about 700 nm.
8. The bonding apparatus of claim 2 ,
wherein the white light has a wavelength band ranging from about 430 nm to about 700 nm.
9. The bonding apparatus of claim 1 ,
wherein each of the first light irradiating device and the second light irradiating device is further connected to a second light source configured to irradiate light other than the white light, and
the first light irradiating device and the second light irradiating device are allowed to switch irradiation of the light from the first light source and irradiation of the light from the second light source.
10. The bonding apparatus of claim 2 ,
wherein each of the first light irradiating device and the second light irradiating device is further connected to a second light source configured to irradiate light other than the white light, and
the first light irradiating device and the second light irradiating device are allowed to switch irradiation of the light from the first light source and irradiation of the light from the second light source.
11. The bonding apparatus of claim 9 ,
wherein the light other than the white light irradiated by the second light irradiating device is red light.
12. The bonding apparatus of claim 10 ,
wherein the light other than the white light irradiated by the second light irradiating device is red light.