Semiconductor device with gate cut structure
A semiconductor device comprising a substrate with a first fin and a second fin disposed on the substrate. A gate electrode is over the first fin and the second fin. A gate-cut pedestal is positioned between the first fin and the second fin, the gate-cut pedestal having side surfaces and a top surface. A portion of the side surfaces of the gate-cut pedestal is covered by the gate electrode. The gate-cut pedestal has a height that is substantially similar to a height of the first fin or the second fin.
1. A semiconductor device comprising:
a substrate;
a first fin and a second fin disposed on the substrate;
a gate electrode over the first fin and the second fin;
a gate-cut pedestal positioned between the first fin and the second fin, the gate-cut pedestal including a first dielectric layer over a dielectric liner, wherein the dielectric liner and the first dielectric layer are made of different dielectric materials and a portion of side surfaces of the first dielectric layer of the gate-cut pedestal is in direct contact with the gate electrode;
an isolation material between the first fin and the second fin, wherein the dielectric liner is above the isolation material and the gate electrode is in direct contact with the isolation material;
spacer structures directly contacting the first dielectric layer and the dielectric liner; and
the gate-cut pedestal having a height that is substantially similar to a height of the first fin.
2. The semiconductor device of claim 1 , further comprising:
a gate-cut block positioned above the gate-cut pedestal, wherein the gate-cut block is wider than the gate-cut pedestal.
3. The semiconductor device of claim 2 , wherein the gate-cut pedestal has an upper section that is uncovered by the gate electrode that extends into the gate-cut block.
4. The semiconductor device of claim 2 ,
wherein the gate-cut block includes a second dielectric layer.
5. The semiconductor device of claim 2 , further comprising:
a metal contact layer covering the gate electrode over the first fin and the second fin, wherein the gate-cut pedestal and the gate-cut block separate the metal contact layer over the first fin and the metal contact layer over the second fin.
6. The semiconductor device of claim 4 , wherein the first dielectric layer and the second dielectric layer are different materials.
7. The semiconductor device of claim 1 , wherein the dielectric liner comprises aluminum oxide (Al 2 O 3 ) or titanium oxide (TiO 2 ).
8. The semiconductor device of claim 4 , wherein the first dielectric layer comprises silicon dioxide (SiO 2 ) or silicon nitride (SiN).
9. The semiconductor device of claim 1 , wherein the dielectric liner directly contacts the isolation material.
10. The semiconductor device of claim 2 , wherein the spacer structures are in direct contact with the gate-cut block.
11. The semiconductor device of claim 1 , wherein the dielectric liner has a first end portion and a second end portion opposite to the first end portion, wherein the first end portion and the second end portion of the dielectric liner are directly below the first dielectric layer and the gate electrode is in direct contact with the first end portion and the second end portion of the dielectric liner.