Molded chip package with anchor structures
Various semiconductor chip packages are disclosed. In one aspect, a semiconductor chip package includes a package substrate that has a first side and a second side opposite to the first side. A semiconductor chip is mounted on the first side. Plural metal anchor structures are coupled to the package substrate and project away from the first side. A molding layer is on the package substrate and at least partially encapsulates the semiconductor chip and the anchor structures. The anchor structures terminate in the molding layer and anchor the molding layer to the package substrate.
1. A semiconductor chip package, comprising:
a package substrate having a first side and a second side opposite to the first side;
a semiconductor chip mounted on the first side;
plural metal anchor structures coupled to the package substrate and projecting away from the first side, wherein the plural metal anchor structures are coupled to a ground pathway or electrically floating, wherein the package substrate comprises plural metal pads, each of the anchor structures directly contacting one of the metal pads; and
a molding layer on the package substrate and at least partially encapsulating the semiconductor chip and the plural metal anchor structures, the plural metal anchor structures terminating in the molding layer and anchoring the molding layer to the package substrate.
2. The semiconductor chip package of claim 1 , wherein the plural metal anchor structures comprise cylinders.
3. The semiconductor chip package of claim 1 , wherein the plural metal anchor structures comprise frustoconical structures.
4. The semiconductor chip package of claim 1 , wherein the plural metal anchor structures comprise a shank and a head.
5. The semiconductor chip package of claim 4 , wherein the head is coined.
6. The semiconductor chip package of claim 1 , wherein the plural metal anchor structures comprise bond wires.
7. The semiconductor chip package of claim 1 , comprising plural surface components mounted on the first side.
8. The semiconductor chip package of claim 1 , wherein the package substrate comprises a coreless build-up substrate.
9. A semiconductor chip package, comprising:
a package substrate having a first side and a second side opposite to the first side;
a semiconductor chip mounted on the first side;
a stiffener ring mounted on the first side, the stiffener ring being continuously formed and having a central opening to accommodate the semiconductor chip and plural openings; and
a molding layer on the package substrate and at least partially encapsulating the semiconductor chip and the stiffener ring, the plural openings being filled with portions of the molding layer wherein physical engagement of the portions in the plural openings anchor the molding layer to the package substrate.
10. A device comprising:
a semiconductor chip package, comprising:
a package substrate having a first side and a second side opposite to the first side; a semiconductor chip mounted on the first side;
plural metal anchor structures coupled to the package substrate and projecting away from the first side, wherein the plural metal anchor structures are coupled to a ground pathway or electrically floating, wherein the package substrate comprises plural metal pads, each of the anchor structures directly contacting one of the metal pads; and
a molding layer on the package substrate and at least partially encapsulating the semiconductor chip and the plural metal anchor structures, the plural metal anchor structures terminating in the molding layer and anchoring the molding layer to the package substrate.
11. The device of claim 10 , wherein the plural metal anchor structures comprise cylinders.
12. The device of claim 10 , wherein the plural metal anchor structures comprise frustoconical structures.
13. The device of claim 10 , wherein the plural metal anchor structures comprise a shank and a head.
14. The device of claim 13 , wherein the head is coined.
15. The device of claim 10 , wherein the plural metal anchor structures comprise bond wires.
16. The device of claim 10 , comprising plural surface components mounted on the first side.
17. The device of claim 10 , wherein the package substrate comprises a coreless build-up substrate.