Connection structure for optical waveguide chip
A connection structure for optical waveguide chips includes a silica-based PLC in which grooves are formed, spacer steel balls fitted in the grooves, and silica-based PLCs in which grooves into which the spacer steel balls to be fitted are formed, the silica-based PLCs being mounted on the silica-based PLC by being supported by the spacer steel balls. A conductor wire formed in the silica-based PLC and a conductor wire formed in the silica-based PLC are electrically connected to each other by a conductor film formed in the groove, the spacer steel balls and a conductor film formed in the groove.
1. A connection structure for optical waveguide chips, the connection structure comprising:
a base substrate having a plurality of first grooves therein;
a plurality of spacer members fitted in the plurality of first grooves, respectively, wherein a part of each spacer member protrudes from the base substrate;
a plurality of optical waveguide chips each comprising a substrate and an optical waveguide layer on the substrate, a plurality of second grooves in the optical waveguide layer at locations opposed to the plurality of first grooves, wherein the protruding part of each spacer member is fitted into a respective one of the plurality of second grooves, wherein the plurality of optical waveguide chips are mounted on the base substrate and supported by the plurality of spacer members, and wherein the plurality of optical waveguide chips are mounted on the base substrate such that entrance and exit end faces of the optical waveguide layers of two adjacent optical waveguide chips of the plurality of optical waveguide chips are opposed to each other;
a first conductor wire in the base substrate; and
a second conductor wire in at least one optical waveguide chip of the plurality of optical waveguide chips, wherein the first conductor wire and the second conductor wire are electrically connected to each other by at least one spacer member of the plurality of spacer members having a conductivity.
2. The connection structure according to claim 1 , wherein the base substrate further includes a first conductor film electrically connected to the first conductor wire on an inner face of at least one of the plurality of first grooves into which the at least one spacer member having the conductivity is fitted.
3. The connection structure according to claim 2 , wherein the at least one optical waveguide chip further includes a second conductor film electrically connected to the second conductor wire on an inner face of the second groove that is opposed to the at least one of the plurality of first grooves having the first conductor film.
4. The connection structure according to claim 3 , wherein the first conductor film is in all of the plurality of first grooves, and the second conductor film is in all of the plurality of second grooves.
5. The connection structure according to claim 3 , wherein the first conductor wire and the first conductor film have a same film structure, and the second conductor wire and the second conductor film have a same film structure.
6. The connection structure according to claim 1 , wherein an entirety of the at least one spacer member having the conductivity comprises a conductor.
7. The connection structure according to claim 1 , wherein a surface of the at least one spacer member having the conductivity comprises a conductor.
8. The connection structure according to claim 1 , wherein all of the plurality of spacer members have the conductivity and have a same structure.
9. A connection structure for optical waveguide chips, the connection structure comprising:
a first optical waveguide chip comprising a first substrate, a first optical waveguide layer on the first substrate, and a plurality of first grooves in the first optical waveguide layer;
a plurality of spacer members fitted in the plurality of first grooves, respectively, such that a part of each of the plurality of spacer members protrudes from the first optical waveguide chip;
a second optical waveguide chip comprising a second substrate, a second optical waveguide layer on the second substrate, and a plurality of second grooves in the second optical waveguide layer at locations opposite the plurality of first grooves, wherein the protruding part of each spacer member is fitted into a respective one of the plurality of second grooves, wherein the second optical waveguide chip is mounted on the first optical waveguide chip and supported by the plurality of spacer members;
a first conductor wire in the first optical waveguide chip; and
a second conductor wire in the second optical waveguide chip, wherein the first conductor wire and the second conductor wire are electrically connected to each other by at least one spacer member of the plurality of spacer members having a conductivity.
10. The connection structure according to claim 9 , wherein:
the first optical waveguide chip further includes a first conductor film electrically connected to the first conductor wire on an inner face of at least one of the plurality of first grooves into which the at least one spacer member having the conductivity is fitted; and
the second optical waveguide chip further includes a second conductor film electrically connected to the second conductor wire on an inner face of the second groove that is opposite the at least one of the plurality of first grooves having the first conductor film.
11. The connection structure according to claim 10 , wherein the first conductor film is in all of the plurality of first grooves, and the second conductor film is in all of the plurality of second grooves.
12. The connection structure according to claim 10 , wherein the first conductor wire and the first conductor film have a same film structure, and the second conductor wire and the second conductor film have a same film structure.
13. The connection structure according to claim 9 , wherein an entirety of the at least one spacer member having the conductivity comprises a conductor.
14. The connection structure according to claim 9 , wherein a surface of the at least one spacer member having the conductivity comprises a conductor.
15. The connection structure according to claim 9 , wherein all of the plurality of spacer members have the conductivity and have a same structure.
16. A method of forming a connection structure for optical waveguide chips, the method comprising:
providing a first optical waveguide chip comprising a first substrate and a first optical waveguide layer on the first substrate;
forming a plurality of first grooves in the first optical waveguide layer;
fitting a plurality of spacer members in the plurality of first grooves, respectively, such that a part of each of the plurality of spacer members protrudes from the first optical waveguide chip;
providing a second optical waveguide chip comprising a second substrate and a second optical waveguide layer on the second substrate;
forming a plurality of second grooves in the second optical waveguide layer at locations opposite the plurality of first grooves;
mounting the second optical waveguide chip on the first optical waveguide chip by fitting the protruding part of each spacer member into a respective one of the plurality of second grooves;
forming a first conductor wire in the first optical waveguide chip; and
forming a second conductor wire in the second optical waveguide chip, wherein the first conductor wire and the second conductor wire are electrically connected to each other by at least one spacer member of the plurality of spacer members having a conductivity.
17. The method according to claim 16 , wherein:
the first optical waveguide chip further includes a first conductor film electrically connected to the first conductor wire on an inner face of at least one of the plurality of first grooves into which the at least one spacer member having the conductivity is fitted; and
the second optical waveguide chip further includes a second conductor film electrically connected to the second conductor wire on an inner face of the second groove that is opposite the at least one of the plurality of first grooves having the first conductor film.
18. The method according to claim 17 , wherein the first conductor film is formed in all of the plurality of first grooves, and the second conductor film is formed in all of the plurality of second grooves.
19. The method according to claim 17 , wherein the first conductor wire and the first conductor film have a same film structure, and the second conductor wire and the second conductor film have a same film structure.
20. The method according to claim 16 , wherein an entirety of the at least one spacer member having the conductivity comprises a conductor, or wherein a surface of the at least one spacer member having the conductivity comprises a conductor.