Semiconductor device package
The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.
1. A semiconductor device package, comprising:
a substrate;
an electronic component disposed on the substrate;
a package body disposed on the substrate and encapsulating the electronic component; and
a capacitor disposed above the electronic component;
wherein the capacitor is exposed from the package body;
wherein the capacitor comprises a first conductive layer, a second conductive layer above the first conductive layer, and a dielectric layer between the first conductive layer and the second conductive layer; and
wherein the second conductive layer is electrically connected to the electronic component through a first conductive pillar disposed over the substrate and spaced apart from the electronic component.
2. The semiconductor device package as claimed in claim 1 , wherein a portion of the package body is disposed between the capacitor and the electronic component.
3. The semiconductor device package as claimed in claim 1 , wherein the first conductive layer is electrically connected to the electronic component through a second conductive pillar disposed over the substrate and spaced apart from the electronic component.
4. The semiconductor device package as claimed in claim/wherein the second conductive pillar is disposed between the first conductive layer and the substrate.
5. The semiconductor device package as claimed in claim 1 , wherein the second conductive layer comprises a shielding layer.
6. The semiconductor device package as claimed in claim 1 , wherein a projective area of the second conductive layer on the substrate is overlapped with a projective area of the electronic component on the substrate.
7. The semiconductor device package as claimed in claim 1 , wherein the first conductive pillar has a surface substantially coplanar with a top surface of the package body.
8. The semiconductor device package as claimed in claim 1 , wherein the first conductive pillar has a surface substantially coplanar with a surface of the dielectric layer.
9. The semiconductor device package as claimed in claim 1 , wherein the first conductive layer is electrically connected to the electronic component through a first conductive wire.
10. The semiconductor device package as claimed in claim 9 , wherein the first conductive layer is physically in contact with the first conductive wire.
11. A semiconductor device package, comprising:
a substrate;
an electronic component disposed on the substrate;
a package body disposed on the substrate and encapsulating the electronic component; and
a capacitor disposed above the electronic component;
wherein the capacitor is exposed from the package body;
wherein the capacitor comprises a first conductive layer, a second conductive layer above the first conductive layer, and a dielectric layer between the first conductive layer and the second conductive layer;
wherein the first conductive layer is electrically connected to the electronic component through a conductive wire;
wherein the first conductive layer is physically in contact with the conductive wire.