Method of etching film and plasma processing apparatus
A method of etching a film of a substrate is provided. The substrate includes an underlying region, the film and a mask. The film is provided on the underlying region. The mask is provided on the film. The method includes performing main etching on the film. The main etching is plasma etching of the film and exposes at least a part of the underlying region. The method further includes forming a protective layer on at least a side wall surface of the mask after the performing of the main etching. A material of the protective layer is different from a material of the film. The method further includes performing over-etching on the film after the forming of the protective layer. The over-etching is plasma etching of the film.
1. A method of etching a film of a substrate,
wherein the substrate includes an underlying region, the film provided on the underlying region and a mask provided on the film, and the mask is patterned, and
wherein the method comprises:
performing a main etching on the film, the main etching being a plasma etching on the film, exposing at least a part of the underlying region, and forming a side wall surface in a tapered shape on the film;
forming a protective layer on at least a side wall surface of the mask and on the side wall surface of the film after the performing of the main etching, a material of the protective layer being different from a material of the film;
removing a portion of the protective layer formed on the side wall surface of the film while remaining a portion of the protective layer formed on the side wall surface of the mask; and
performing an over-etching on the film after the forming of the protective layer, the over-etching being a plasma etching on the film,
wherein the substrate further includes a first region and a second region, and
a pattern of the mask in the first region is formed more densely than a pattern of the mask in the second region.
2. The method of claim 1 ,
wherein the side wall surface of the film having the tapered shape defines an opening, and
the over-etching corrects a shape of the side wall surface of the film, which defines the opening, to improve a verticality thereof.
3. The method of claim 1 ,
wherein the forming of the protective layer and the performing of the over-etching are repeated alternately.
4. The method of claim 1 ,
wherein a power level of a bias power for ion attraction onto the substrate in the removing of the portion of the protective layer is higher than a power level of a bias power for ion attraction onto the substrate in each of the performing of the main etching and the performing of the over-etching.
5. The method of claim 1 ,
wherein the mask is made of an organic material.
6. The method of claim 1 ,
wherein the film is a silicon-containing film.
7. The method of claim 6 ,
wherein the silicon-containing film is a silicon nitride film.
8. The method of claim 1 ,
wherein the substrate is maintained in a decompressed environment from a start of the performing of the main etching to an end of the performing of the over-etching.
9. The method of claim 8 ,
wherein the performing of the main etching, the forming of the protective layer and the performing of the over-etching are performed by using a single plasma processing apparatus.
10. The method of claim 1 ,
wherein the protective layer is conformally formed on the substrate.
11. The method of claim 10 ,
wherein the protective layer is formed by atomic layer deposition.