Antenna feeder package structure and packaging method

1. An antenna feeder package structure, comprising:

a first structure of antenna stack;

a second structure of redistribution stack, wherein the first structure of antenna stack is disposed on a first side of the second structure of redistribution stack; and

a third structure of chip connection, disposed on a second side of the second structure of redistribution stack, wherein the first side and the second side of the second structure of redistribution stack are opposite to each other;

wherein the first structure of antenna stack comprises:

a first antenna metal layer comprising a plurality of first patterned metal structures;

a plurality of first metal joint pins, wherein each of the plurality of first metal joint pins is configured to align to one of the plurality of first patterned metal structures in an one-to-one correspondence;

a first packaging layer, and a second antenna metal layer disposed on the first packaging layer, wherein the second antenna metal layer comprises a plurality of second patterned metal structures, wherein the first packaging layer covers the plurality of first metal joint pins except respective top surfaces, wherein each of the top surfaces of the plurality of first metal joint pins is in direct contact with one of the plurality of second patterned metal structures;

a plurality of second metal joint pins, wherein each of the plurality of second metal joint pins is configured to align to said one of the plurality of second patterned metal structures in an one-to-one correspondence, wherein one of the plurality of the first metal joint pins is connected to one of the plurality of second metal joint pins in a one-to-one correspondence;

a second packaging layer disposed to cover the plurality of second metal joint pins except respective top surfaces; and

wherein the second structure of redistribution stack comprises:

a conductive redistribution layer placed on the second packaging layer;

wherein the conductive redistribution layer comprises three portions,

wherein a first portion of the conductive redistribution layer is arranged in direct contact with the top surfaces of the plurality of second metal joint pins;

wherein the third structure further including external interface, comprises:

a metal solder ball;

an antenna circuit chip; and

a bottom filling layer;

wherein a second portion of the conductive redistribution layer is arranged to be above the first portion of the conductive redistribution layer and is connected with the metal solder ball; wherein the metal solder ball is connected to one of the plurality of the first metal joint pins via one of the plurality of the second metal joint pins via said second portion of the conductive redistribution layer;

wherein a third portion of the conductive redistribution layer is arranged to be in direct contact with pads of the antenna circuit chip, wherein the antenna circuit chip is disposed over the third portion of the conductive redistribution layer and at a side of the metal solder ball; and

wherein the bottom filling layer is disposed outside the pads and between the third portion of the conductive redistribution layer and the antenna circuit chip.

2. The antenna feeder package structure according to claim 1 , wherein each of the first and second metal joint pins comprises gold, silver, copper, or aluminum.

3. The antenna feeder package structure according to claim 1 , wherein the first or the second packaging layer comprises polyimide, silica gel or epoxy resin.

4. The antenna feeder package structure according to claim 1 , wherein each of a top surface of the first packaging layer and a top surface of the second packaging layer comprises a flat surface.

5. The antenna feeder package structure according to claim 1 , wherein the antenna feeder package structure further comprises at least two metal joint pin layers and another packaging layer, wherein each of the at least two metal joint pin layers comprises a plurality of metal joint pins.