Electronic device
According to one embodiment, a semiconductor device includes an insulating substrate, a first semiconductor layer formed of silicon and positioned above the insulating substrate, a second semiconductor layer formed of a metal oxide and positioned above the first semiconductor layer, a first insulating film formed of a silicon nitride and positioned between the first semiconductor layer and the second semiconductor layer, and a block layer positioned between the first semiconductor film and the second semiconductor layer, the block layer hydrogen diffusion of which is lower than that of the first insulating film.
1. An electronic device comprising:
a substrate;
a silicon nitride film formed on the substrate;
a first silicon oxide film formed on the silicon nitride film;
a block insulating layer including oxide on the first silicon oxide film;
a metal oxide semiconductor layer formed on the block insulating layer;
a second silicon oxide film covering the metal oxide semiconductor layer; and
a gate electrode formed between the substrate and the silicon nitride film, and facing the metal oxide semiconductor layer, wherein
a thickness of the second silicon oxide film is larger than a thickness of the first silicon oxide film, and the thickness of the second silicon oxide film is larger than a thickness of the silicon nitride film, and the block insulating layer has an even thickness,
the silicon nitride film, the first silicon oxide film, the block insulating layer, the metal oxide semiconductor layer, and the second silicon oxide film are laminated on the substrate in this order,
the gate electrode is entirely covered by the silicon nitride film.
2. The electronic device according to claim 1 , wherein the oxide is metal oxide.
3. The electronic device according to claim 2 , wherein the metal oxide is one of AlOx, TiOx, ZrOx, TaOx, or HfOx.
4. The electronic device according to claim 1 , wherein the oxide is silicon oxide.