IP Library Granted Patent US 11,448,907
Granted Patent B2
US 11,448,907 · App. 17/061,955 · Granted Sep 20, 2022

Bonded bodies for optical modulators, optical modulators and a method of producing bonded bodies for optical modulators

Inventors: Tomoyoshi Tai (Inazawa, JP); Yudai Uno (Nagoya, JP); Jungo Kondo (Miyoshi, JP); Yoshimasa Kobayashi (Nagoya, JP); Tatsuya Hishiki (Nagoya, JP); Hiroharu Kobayashi (Kasugai, JP)
Assignee: NGK INSULATORS, LTD.
G02F1/035G02F2202/20
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,448,907
App. No.
17/061,955
Granted
Sep 20, 2022
Kind
B2
Abstract

A bonded body for an optical modulator includes a supporting substrate, an optical waveguide material provided on the supporting substrate and composed of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate, and an optical waveguide in the optical waveguide material. The supporting substrate is composed of a material selected from the group consisting of magnesium oxide and a magnesium-silicon composite oxide.

Claims (22)

1. A bonded body for an optical modulator, said bonded body comprising:

a supporting substrate;

an optical waveguide material provided on said supporting substrate and comprising a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and

an optical waveguide in said optical waveguide material,

wherein said supporting substrate comprises a material selected from the group consisting of steatite and forsterite, so as to provide an improved bandwidth of electro-optic modulation by the optical modulator.

2. The bonded body for the optical modulator of claim 1 , further comprising a bonding layer between said supporting substrate and said optical waveguide material.

3. The bonded body for the optical modulator of claim 2 , wherein said bonding layer comprises an oxide film.

4. An optical modulator comprising:

the bonded body for the optical modulator of claim 1 ; and

an electrode provided on said optical waveguide material and modulating a light propagating in said optical waveguide.

5. A method of producing a bonded body for an optical modulator, said method comprising the steps of:

bonding a supporting substrate comprising a material selected from the group consisting of steatite and forsterite, so as to provide an improved bandwidth of electro-optic modulation by the optical modulator, and an optical waveguide material comprising a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and

providing an optical waveguide in said optical waveguide material.

6. The method of claim 5 , further comprising the step of providing a bonding layer between said supporting substrate and said optical waveguide material.

7. The method of claim 5 , further comprising the steps of:

forming a first oxide film on said optical waveguide material;

forming a second oxide film on said supporting substrate; and

directly bonding said first oxide film and said second oxide film.

8. The method of claim 7 , further comprising the steps of:

irradiating a neutralized atomic beam on a surface of said first oxide film to provide a first activated surface; and

irradiating a neutralized atomic beam on a surface of said second oxide film to provide a second activated surface,

wherein said first activated surface and said second activated surface are directly bonded with each other.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 2, 2020
From: TAI, TOMOYOSHI; UNO, YUDAI; KONDO, JUNGO; KOBAYASHI, YOSHIMASA; HISHIKI, TATSUYA; KOBAYASHI, HIROHARU
To: NGK INSULATORS, LTD.
Reel/Frame 053962/0122 →
Priority Claims (1)
JP JP2019-183583 · Oct 4, 2019 · national
Continuity (1)
Related Publication 20210103164A1 · Apr 8, 2021
Cited By (6)
US 12,282,214 US 12,422,726 US 12,468,184 US 12,601,938 US 12,656,637 US 12,675,009