Method of making thin film lithium niobate electro-optical modulators
A method of forming an electro-optical modulator including forming a lithium-niobate (LN) wafer including an optical waveguide situated within and proximate a first side of the LN wafer; bonding the LN wafer to a substrate such that the first side of the LN wafer faces the substrate; thinning the LN wafer; and forming coplanar transmission lines over and/or on a second side of the LN wafer, wherein the coplanar transmission lines extend parallel with and are laterally on either side of the optical waveguide.
1. A method, comprising:
forming a lithium-niobate (LN) wafer including an optical waveguide situated within and proximate a first side of the LN wafer;
forming a bonding layer over and/or on a first side of a substrate; and
thinning the bonding layer to a first thickness,
bonding the LN wafer to the substrate such that the first side of the LN wafer faces the first side of substrate;
thinning the LN wafer; and
forming coplanar transmission lines over and/or on a second side of the LN wafer,
wherein the coplanar transmission lines extend parallel with and are laterally on either side of the optical waveguide;
wherein bonding the LN wafer to the substrate comprises attaching the LN wafer to the substrate via the thinned bonding layer, and
wherein thinning the LN wafer comprises thinning the LN wafer so that a defined total thickness is achieved for the attached LN wafer and the bonding layer.
2. The method of claim 1 , wherein forming the LN wafer comprises diffusing titanium (Ti) into the LN wafer to form the optical waveguide.
3. The method of claim 1 , wherein forming the LN wafer comprises performing an annealed proton exchange with the LN wafer to form the optical waveguide.
4. The method of claim 1 , wherein bonding the LN wafer to the substrate further comprises forming a bonding layer over and/or on the first side of the LN wafer.
5. The method of claim 4 , wherein the bonding layer comprises a polymer.
6. The method of claim 4 , wherein the bonding layer comprises an ultraviolet (UV) glue, a benzocyclobutene (BCB) polymer, a SU-8 polymer, a dry film photoresist, or a bonding sheet.
7. The method of claim 4 , wherein the bonding layer comprises a dielectric.
8. The method of claim 4 , wherein the bonding layer comprises a silicon (Si) nano-adhesive bond or a surface activated fusion bond.
9. The method of claim 4 , wherein bonding the LN wafer to the substrate comprises subjecting the first side of the LN wafer to Helium ion implantation then forming the bonding layer over and/or on either the first side of the LN wafer or over and/or on the first side of the substrate.
10. The method of claim 4 , wherein bonding the LN wafer to the substrate comprises:
forming a first ridge pattern on the first side of the LN wafer;
forming a second ridge pattern on the bonding layer over and/or on the first side of the substrate; and
attaching the LN wafer to the substrate such that the first ridge pattern is mated to the second ridge pattern.
11. The method of claim 4 , wherein the bonding layer comprises first and second bonding layers, and wherein bonding the LN wafer to the substrate comprises:
forming the first bonding layer over and/or on the first side of the substrate including a first argon (Ar) fast atom bombardment (FAB) of a silicon target;
forming the second bonding layer over and/or on the first side of the LN wafer including a second Ar FAB of the silicon target; and
attaching the LN wafer to the substrate such via the Ar irradiated first and second bonding layers.
12. The method of claim 4 , wherein the bonding layer comprises first and second bonding layers, and wherein bonding the LN wafer to the substrate comprises:
forming the first bonding layer over and/or on the first side of the substrate;
subjecting the first bonding layer to a first plasma treatment;
forming the second bonding layer over and/or on the first side of the LN wafer;
subjecting the second bonding layer to a second plasma treatment; and
attaching the LN wafer to the substrate via the plasma-treated first and second bonding layers.
13. The method of claim 12 , wherein at least one of the first and second plasma treatments comprises an oxygen-nitrogen plasma treatment.
14. The method of claim 12 , wherein bonding the LN wafer to the substrate further comprises annealing the plasma-treated first and second bonding layers.
15. The method of claim 1 , wherein the substrate comprises silicon-oxide (SiO 2 ), silicon, fused silica, or single crystal quartz.
16. The method of claim 1 , wherein the coplanar transmission lines comprise gold.
17. The method of claim 1 , wherein thinning the LN wafer comprises polishing the second side of the LN wafer.
18. The method of claim 1 , wherein thinning the LN wafer comprises chemical mechanical polishing (CMP) the second side of the LN wafer.
19. The method of claim 1 , further comprising: thinning the substrate to a first-second thickness.
20. The method of claim 1 , further comprising forming an alignment marking on the first side of the LN wafer.
21. The method of claim 20 , wherein the alignment marking comprises chromium (Cr) or chromium-silicon (Cr—Si).
22. The method of claim 1 , further comprising forming a wafer identification marking on the second side of the LN wafer.
23. The method of claim 22 , further comprising forming a substrate identification marking on a first side of the substrate opposite a second side upon which the LN wafer attaches to the substrate.
24. The method of claim 1 , further comprising forming a periodically poled lithium niobate (PPLN) along the optical waveguide of the LN wafer.
25. The method of claim 24 , wherein forming the PPLN comprises applying an electric field across the optical waveguide in a directional substantially parallel to a Z-axis of a crystal structure of the LN wafer.