IP Library › Granted Patent US 11,454,491
Granted Patent B2
US 11,454,491 · App. 16/910,676 · Granted Sep 27, 2022

Systems having light source with extended spectrum for semiconductor chip surface topography metrology

Inventors: Sicong Wang (Wuhan, CN); Xiaoye Ding (Wuhan, CN)
Assignee: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
G01B9/02044G01B9/02074G01B11/306G01N21/9501H01L21/67288
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Quick Facts
Patent No.
US 11,454,491
App. No.
16/910,676
Granted
Sep 27, 2022
Kind
B2
Abstract

Embodiments of systems for classifying interference signals are disclosed. In an example, a system for classifying interference signals includes an interferometer including a light source and a detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip. A spectrum of the light source is greater than a spectrum of white light. The at least one processor is configured to classify the interference signals into a plurality of categories using a model. Each of the categories corresponds to a region having a same material on the surface of the semiconductor chip.

Claims (33)

1. A system for classifying interference signals, comprising:

an interferometer comprising a light source and a detector, the interferometer configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip, wherein a spectrum of the light source is greater than a spectrum of white light; and

at least one processor configured to:

cluster the plurality of interference signals into a plurality of clusters using a model; and

adjust the plurality of clusters into a plurality of categories based on a design of the semiconductor chip, wherein the plurality of categories are associated with interference signal classification, and wherein each of the plurality of categories corresponds to a region having a same material on the surface of the semiconductor chip.

2. The system of claim 1 , wherein the spectrum of the light source comprises at least one of ultraviolet (UV) light or infrared (IR) light.

3. The system of claim 1 , wherein a range of wavelengths of the spectrum of the light source is greater than a range between about 400 nm and about 900 nm.

4. The system of claim 3 , wherein the range of wavelengths of the spectrum of the light source is between about 190 nm and about 1,100 nm.

5. The system of claim 1 , wherein the light source comprises a Xenon (Xe) lamp.

6. The system of claim 5 , wherein the detector comprises a white light charge coupled device (CCD) or a white light charge complementary metal oxide semiconductor (CMOS) image sensor.

7. The system of claim 1 , wherein each of the interference signals comprises an interference fringe having a width not greater than about 2 μm.

8. The system of claim 7 , wherein the width of the interference fringe is about 1.2 μm.

9. The system of claim 1 , wherein at least part of the surface of the semiconductor chip comprises a transparent layer.

10. The system of claim 9 , wherein a minimum thickness of the transparent layer is not greater than about 2 μm.

11. The system of claim 1 , wherein the interferometer further comprises an optical element configured to manipulate the spectrum of the light source.

12. The system of claim 11 , wherein the optical element comprises at least one of a filter or an antireflection film.

13. A system for classifying interference signals, comprising:

an interferometer comprising a light source and a detector, the interferometer configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip, wherein each of the interference signals comprises an interference fringe having a width not greater than about 2 μm; and

at least one processor configured to:

cluster the plurality of interference signals into a plurality of clusters using a model; and

adjust the plurality of clusters into a plurality of categories based on a design of the semiconductor chip, wherein the plurality of categories are associated with interference signal classification, and wherein each of the plurality of categories corresponds to a region having a same material on the surface of the semiconductor chip.

14. The system of claim 13 , wherein the width of the interference fringe is about 1.2 μm.

15. The system of claim 13 , wherein a spectrum of the light source is greater than a spectrum of white light.

16. The system of claim 15 , wherein the spectrum of the light source comprises at least one of ultraviolet (UV) light or infrared (IR) light.

17. The system of claim 15 , wherein a range of wavelengths of the spectrum of the light source is greater than a range between about 400 nm and about 900 nm.

18. The system of claim 13 , wherein the light source comprises a Xenon (Xe) lamp.

19. The system of claim 18 , wherein the detector comprises a white light charge coupled device (CCD) or a white light charge complementary metal oxide semiconductor (CMOS) image sensor.

20. A system for classifying spectrum signals, comprising:

an interferometer comprising a light source and a detector, the interferometer configured to provide a plurality of interference signals each corresponding to a respective one of a plurality of positions on a surface of a semiconductor chip, wherein a spectrum of the light source is greater than a spectrum of white light; and

at least one processor configured to:

transform the plurality of interference signals into a plurality of spectrum signals each corresponding to a respective one of the positions on the surface of the semiconductor chip;

cluster the plurality of interference signals into a plurality of clusters using a model; and

adjust the plurality of clusters into a plurality of categories based on a design of the semiconductor chip, wherein the plurality of categories are associated with interference signal classification, and wherein each of the plurality of categories corresponds to a region having a same material on the surface of the semiconductor chip.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 24, 2020
From: WANG, SICONG; DING, XIAOYE
To: YANGTZE MEMORY TECHNOLOGIES CO., LTD.
Reel/Frame 053032/0277 →
Continuity (2)
Continuation PCTCN2020076430 · Feb 24, 2020
Related Publication 20210262778A1 · Aug 26, 2021
Cited By (2)
US 12,460,920 US 12,644,694