Substrate processing apparatus, and substrate processing method
View Patent ↗A substrate processing apparatus processes a substrate having an upper side and a rear side. The substrate processing apparatus includes a substrate holder, a filler feeder, and a first cleaning liquid feeder. The substrate holder rotates the substrate while holding a central portion of the rear side of the substrate. The filler feeder feeds filler to the upper side of the substrate held by the substrate holder. The first cleaning liquid feeder feeds a cleaning liquid to the rear side of the substrate held by the substrate holder. The first cleaning liquid feeder feeds the cleaning liquid to an area, held by the substrate holder, of the rear side of the substrate.
1. A substrate processing apparatus, processing a substrate having an upper side and a rear side and comprising:
a substrate holder configured to rotate the substrate while holding a central portion of the rear side of the substrate,
a filler nozzle configured to feed filler to the upper side of the substrate held by the substrate holder, and
a first nozzle configured to feed a cleaning liquid to the rear side of the substrate held by the substrate holder, wherein
the first nozzle is directed toward the substrate such that an angle of a component of a travelling direction projected on the rear side of the substrate relative to a perpendicular direction along the rear side of the substrate is within a range of from 30° outward of the perpendicular direction in a radial direction of the substrate to 20° inward of the perpendicular direction in a direction opposite to the radial direction, the perpendicular direction being perpendicular to a direction from a center of the substrate toward a reaching point of the cleaning liquid on the rear side of the substrate, the travelling direction being a travelling direction of the cleaning liquid just before the cleaning liquid reaches the reaching point,
the first nozzle is provided diagonally upward at a predetermined angle so as to be directed toward the rear side of the substrate, and
the first nozzle feeds the cleaning liquid toward an area, held by the substrate holder, of the rear side of the substrate.
2. The substrate processing apparatus according to claim 1 , wherein
the substrate holder allows the substrate holder to stick to the central portion of the rear side of the substrate.
3. The substrate processing apparatus according to claim 1 , wherein
when feeding the cleaning liquid toward the area, held by the substrate holder, of the rear side of the substrate, the first nozzle feeds the cleaning liquid such that the cleaning liquid is spread on the rear side of the substrate and approaches the area, held by the substrate holder, of the rear side of the substrate without coming into contact with the area.
4. The substrate processing apparatus according to claim 1 , further comprising:
a second nozzle configured to feed a cleaning liquid to the rear side of the substrate held by the substrate holder, wherein
a distance from the center of the substrate toward a reaching point on the substrate to which the first nozzle ejects a cleaning liquid is different from a distance from the center of the substrate toward a reaching point on the substrate to which the second nozzle ejects a cleaning liquid.
5. The substrate processing apparatus according to claim 4 , wherein
the cleaning liquid ejected from the first nozzle is different from the cleaning liquid ejected from the second nozzle.
6. The substrate processing apparatus according to claim 1 , further comprising
a motor or a cylinder configured to move the first nozzle in a horizontal direction.
7. The substrate processing apparatus according to claim 1 , further comprising
a third nozzle configured to feed a cleaning liquid for cleaning an edge of the substrate.
8. The substrate processing apparatus according to claim 7 , wherein
a distance from the center of the substrate to a point on the substrate to which the cleaning liquid from the third nozzle is fed is longer than a distance from the center of the substrate to a point on the substrate to which the cleaning liquid from the first nozzle is fed.
9. The substrate processing apparatus according to claim 1 , wherein
a component contained in the cleaning liquid is selected from the group consisting of isopropyl alcohol, propylene glycol monomethyl ether acetate, 1-ethoxy-2-propanol, and acetone.
10. The substrate processing apparatus according to claim 1 , further comprising
an inert gas nozzle configured to feed an inert gas to the rear side of the substrate.
11. The substrate processing apparatus according to claim 1 , wherein
the first nozzle feeds the cleaning liquid such that a distance between the reaching point of the cleaning liquid and the substrate holder is not less than 0.5 mm and not greater than 5.0 mm.
12. The substrate processing apparatus according to claim 1 , wherein
the first nozzle feeds the cleaning liquid such that a distance between the reaching point of the cleaning liquid and the substrate holder is not less than 0.8 mm and not greater than 4.0 mm.