Power semiconductor module and power conversion apparatus
A power semiconductor module includes an insulating substrate, a first conductive circuit pattern, a second conductive circuit pattern, a first semiconductor device, a second semiconductor device, a sealing member, and a first barrier layer. The sealing member seals the first semiconductor device, the second semiconductor device, the first conductive circuit pattern, and the second conductive circuit pattern. At least one of the first barrier layer and the sealing member includes a first stress relaxation portion. This configuration improves the reliability of the power semiconductor module.
1. A power semiconductor module comprising:
an insulating substrate including a first main face;
a first conductive circuit pattern provided on the first main face;
a second conductive circuit pattern provided on the first main face, the second conductive circuit pattern being separated from the first conductive circuit pattern by a first gap;
a first semiconductor device joined to the first conductive circuit pattern;
a second semiconductor device joined to the second conductive circuit pattern;
a sealing member sealing the first semiconductor device, the second semiconductor device, the first conductive circuit pattern, and the second conductive circuit pattern; and
a first barrier layer disposed on an opposite side from the insulating substrate with respect to the first semiconductor device and the second semiconductor device, the first barrier layer being provided on or in the sealing member,
at least one of the first barrier layer and the sealing member including a first stress relaxation portion,
in plan view of the first main face, the first stress relaxation portion overlapping the first gap in such a way that a center of the first gap is within the first stress relaxation portion.
2. The power semiconductor module according to claim 1 , wherein
the first barrier layer includes
a first surface on a side where the first semiconductor device and the second semiconductor device are located, and
a second surface on a side opposite to the first surface, and
the first stress relaxation portion is a first recess formed in at least one of the first surface and the second surface.
3. The power semiconductor module according to claim 2 , wherein
the first barrier layer is provided on the sealing member,
the first recess is formed in the first surface, and
at least a part of the first recess is a cavity which is not filled with the sealing member.
4. The power semiconductor module according to claim 2 , wherein
the first stress relaxation portion is provided in the first barrier layer in such a way that the first stress relaxation portion is at a location corresponding to the first conductive circuit pattern, the second conductive circuit pattern, and the first gap,
a thickness of the first barrier layer gradually decreases toward a first portion of the first barrier layer at least in the first stress relaxation portion, wherein the first portion overlaps the first gap in plan view of the first main face, and
the thickness of the first barrier layer is smallest at the first portion of the first stress relaxation portion.
5. The power semiconductor module according to claim 1 , wherein
the first barrier layer includes
a first surface on a side where the first semiconductor device and the second semiconductor device are located, and
a second surface on a side opposite to the first surface, and
the first stress relaxation portion is a first through portion connecting the first surface to the second surface.
6. The power semiconductor module according to claim 5 , further comprising a second barrier layer such that the second barrier layer and the first barrier layer are stacked, and
in plan view of the first main face, at least a part of the first through portion overlaps the second barrier layer.
7. The power semiconductor module according to claim 6 , wherein
at least one of the second barrier layer and the sealing member includes a second stress relaxation portion.
8. The power semiconductor module according to claim 1 , wherein
the sealing member includes an outer surface, and
the first stress relaxation portion is a second recess formed in the outer surface.
9. The power semiconductor module according to claim 8 , wherein
the first stress relaxation portion is provided in the sealing member in such a way that the first stress relaxation portion is at a location corresponding to the first conductive circuit pattern, the second conductive circuit pattern, and the first gap, and
the outer surface is gradually recessed toward a second portion of the outer surface at least in the first stress relaxation portion, wherein the second portion overlaps the first gap in plan view of the first main face, and
the outer surface is recessed deepest at the second portion of the first stress relaxation portion.
10. The power semiconductor module according to claim 1 , wherein
the insulating substrate includes a first insulating substrate segment and a second insulating substrate segment, wherein
the first conductive circuit pattern is provided on the first insulating substrate segment,
the second conductive circuit pattern is provided on the second insulating substrate segment, and
the second insulating substrate segment is separated from the first insulating substrate segment by a second gap, and
in plan view of the first main face, the first stress relaxation portion overlaps the second gap.
11. The power semiconductor module according to claim 10 , further comprising a base plate disposed on an opposite side from the first semiconductor device and the second semiconductor device with respect to the insulating substrate, wherein
the first insulating substrate segment and the second insulating substrate segment are joined to the base plate.
12. The power semiconductor module according to claim 1 , further comprising a second barrier layer such that the second barrier layer and the first barrier layer are stacked.
13. The power semiconductor module according to claim 12 , wherein
at least one of the second barrier layer and the sealing member includes a second stress relaxation portion.
14. The power semiconductor module according to claim 13 , wherein
the second barrier layer includes
a third surface on a side where the first semiconductor device and the second semiconductor device are located, and
a fourth surface on a side opposite to the third surface, and
the second stress relaxation portion is a third recess formed in at least one of the third surface and the fourth surface.
15. The power semiconductor module according to claim 13 , wherein
the second barrier layer includes
a third surface on a side where the first semiconductor device and the second semiconductor device are located, and
a fourth surface on a side opposite to the third surface, and
the second stress relaxation portion is a second through portion connecting the third surface to the fourth surface.
16. The power semiconductor module according to claim 13 , wherein
in plan view of the first main face, at least a part of the second stress relaxation portion overlaps the first stress relaxation portion.
17. A power conversion apparatus comprising:
a main conversion circuit including the power semiconductor module according to claim 1 , wherein the main conversion circuit converts input power and outputs the converted power, and
a control circuit to output a control signal to the main conversion circuit for controlling the main conversion circuit.