IP Library › Granted Patent US 11,476,831
Granted Patent B2
US 11,476,831 · App. 16/162,791 · Granted Oct 18, 2022

Surface acoustic wave device

Inventors: Yasuhiko Hirano (Nagaokakyo, JP); Daisuke Sekiya (Nagaokakyo, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H03H9/0576H03H9/02897H03H9/059H03H9/1064H03H9/1092
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Quick Facts
Patent No.
US 11,476,831
App. No.
16/162,791
Granted
Oct 18, 2022
Kind
B2
Abstract

A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate, a plurality of partition-support layers each of which is arranged in a region of the main surface surrounded by an outer periphery of the main surface, and a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode. The plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other, and a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from a second direction perpendicular or substantially perpendicular to a first direction in which the plurality of partition-support layers extend.

Claims (48)

1. A surface acoustic wave device comprising:

a piezoelectric substrate;

an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate;

a plurality of partition-support layers each of which is arranged in a region of the main surface, the region being surrounded by an outer periphery of the main surface, the plurality of partition-support layers extending, when the piezoelectric substrate is viewed in plan, in a first direction, which is parallel or substantially parallel to the main surface, and being arranged in a second direction parallel or substantially parallel to the main surface and perpendicular or substantially perpendicular to the first direction;

a cover layer that is disposed above the plurality of partition-support layers and that covers the interdigital transducer electrode; wherein

the plurality of partition-support layers include a first partition-support layer and a second partition-support layer that are adjacent to each other; and

a portion of the first partition-support layer and a portion of the second partition-support layer do not overlap each other when viewed from the second direction.

2. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers further include a third partition-support layer and a fourth partition-support layer that are adjacent to each other; and

a distance between the third partition-support layer and the fourth partition-support layer is larger than a distance between the first partition-support layer and the second partition-support layer.

3. The surface acoustic wave device according to claim 1 , wherein

the plurality of partition-support layers further include a third partition-support layer and a fourth partition-support layer that are adjacent to each other; and

among gaps between adjacent ones of the plurality of partition-support layers, the gap between the third partition-support layer and the fourth partition-support layer is largest, and the gap between the first partition-support layer and the second partition-support layer is smallest.

4. The surface acoustic wave device according to claim 1 , wherein a width of the first partition-support layer is equal or substantially equal to a width of the second partition-support layer.

5. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers further include a third partition-support layer; and

a width of at least one of the first partition-support layer or the second partition-support layer is smaller than a width of the third partition-support layer.

6. The surface acoustic wave device according to claim 1 , wherein among widths of the plurality of partition-support layers, a width of at least one of the first partition-support layer or the second partition-support layer is smallest.

7. The surface acoustic wave device according to claim 1 , wherein each of the first partition-support layer and the second partition-support layer extends to a position that is closer to the outer periphery than to a center of the region of the main surface in the first direction.

8. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers further includes a third partition-support layer that extends to a position that is closer to the outer periphery than to a center of the region of the main surface in the first direction.

9. The surface acoustic wave device according to claim 1 , further comprising:

an outer-periphery-frame support layer that is arranged on the main surface of the piezoelectric substrate along the outer periphery; wherein

each of the first partition-support layer and the second partition-support layer extends to a position that is closer to the outer-periphery-frame support layer than to a center of the region of the main surface in the first direction.

10. The surface acoustic wave device according to claim 1 , further comprising:

an outer-periphery-frame support layer that is arranged on the main surface of the piezoelectric substrate along the outer periphery; wherein

the plurality of partition-support layers further includes a third partition-support layer that extends to a position that is closer to the outer-periphery-frame support layer than to a center of the region of the main surface in the first direction.

11. The surface acoustic wave device according to claim 1 , wherein the interdigital transducer electrode is provided between the first partition-support layer and the second partition-support layer.

12. The surface acoustic wave device according to claim 1 , further comprising:

an outer-periphery-frame support layer that is arranged on the main surface of the piezoelectric substrate along the outer periphery; wherein

the first partition-support layer does not extend to or is not in contact with the outer-periphery-frame support layer.

13. The surface acoustic wave device according to claim 1 , wherein the plurality of partition-support layers extend, when the piezoelectric substrate is viewed in plan, straight or substantially straight in the first direction.

14. The surface acoustic wave device according to claim 1 , wherein when the piezoelectric substrate is viewed in plan, where an end of the first partition-support layer and an end of the second partition-support layer that are oriented in the first direction are first ends, and another end of the first partition-support layer and another end of the second partition-support layer that are oriented in a direction opposite to the first direction are second ends, a distance from the first end of the first partition-support layer to one side of the outer periphery that is closest to the first end of the first partition-support layer is smaller than a distance from the second end of the first partition-support layer to another side of the outer periphery that is closest to the second end of the first partition-support layer, and a distance from the first end of the second partition-support layer to the one side of the outer periphery that is closest to the first end of the second partition-support layer is larger than a distance from the second end of the second partition-support layer to the another side of the outer periphery that is closest to the second end of the second partition-support layer.

15. A surface acoustic wave device comprising:

a piezoelectric substrate;

an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate;

a wiring pattern that is disposed on the main surface of the piezoelectric substrate and connected to the interdigital transducer electrode;

an outer-periphery-frame support layer that covers a periphery of the main surface of the piezoelectric substrate;

a protective film that covers the interdigital transducer electrode and the wiring pattern;

a partition-support layer vertically arranged on the protective film;

a cover layer that is disposed above the partition-support layer and that covers the interdigital transducer electrode; wherein

the partition-support layer is separate and spaced apart from the outer-periphery-frame support layer when the piezoelectric substrate is viewed in plan.

16. A surface acoustic wave device comprising:

a piezoelectric substrate;

an interdigital transducer electrode that is disposed on a main surface of the piezoelectric substrate;

a wiring pattern that is disposed on the main surface of the piezoelectric substrate and connected to the interdigital transducer electrode;

an outer-periphery-frame support layer that covers a periphery of the main surface of the piezoelectric substrate;

a partition-support layer vertically arranged and directly on the wiring pattern; and

a cover layer that is disposed above the partition-support layer and that covers the interdigital transducer electrode; and

a columnar electrode that defines a portion of a wiring path connected to the wiring pattern and that extends through each of the outer-periphery-frame support layer and the cover layer; wherein

a side surface portion of the columnar electrode is exposed to a hollow space provided above the interdigital transducer electrode when the piezoelectric substrate is viewed in plan.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 17, 2018
From: HIRANO, YASUHIKO; SEKIYA, DAISUKE
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 047198/0626 →
Priority Claims (1)
JP 2015-252619 · Dec 24, 2015 · national
Continuity (2)
Continuation 15375360 · Dec 12, 2016
Related Publication 20190052242A1 · Feb 14, 2019