IP Library › Granted Patent US 11,484,291
Granted Patent B2
US 11,484,291 · App. 15/541,732 · Granted Nov 1, 2022

Interposer electrical interconnect coupling methods, apparatuses, and systems

Inventor: Dino Francesco Cuscuna (Eindhoven, NL)
Assignee: KONINKLIJKE PHILIPS N.V.
A61B8/4494A61B8/0883A61B8/12A61B8/445B06B1/02G01S7/52079G10K11/004
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Quick Facts
Patent No.
US 11,484,291
App. No.
15/541,732
Granted
Nov 1, 2022
Kind
B2
Abstract

Systems, methods, and apparatuses for coupling a flexible circuit to a printed circuit board (PCB) with an interposer in an ultrasound probe are disclosed. A bolster plate configured to compress the PCB, interposer, and flexible circuit against a transducer mount is disclosed. A method of coupling a bolster plate to a transducer mount with fasteners is disclosed. Fasteners that do not pass through the PCB, interposer, and flexible circuit are disclosed.

Claims (31)

1. An ultrasound probe, comprising:

an elongate member having a proximal portion and a distal portion configured for insertion into a body lumen of a patient;

a transducer assembly coupled to the distal portion of the elongate member,

wherein the transducer assembly comprises:

a transducer mount comprising:

a length with a first end and an opposite second end;

an upper surface; and

a lower surface;

a transducer stack coupled to the upper surface of the transducer mount;

a flexible circuit coupled to the transducer stack and wrapped under the first end of the transducer mount, wherein the flexible circuit covers a portion of the lower surface of the transducer mount;

an interposer adjacent to the flexible circuit, opposite the lower surface of the transducer mount,

wherein the flexible circuit is directly electrically coupled to the transducer stack and the interposer;

a printed circuit board adjacent to the interposer opposite the flexible circuit and electrically coupled to the flexible circuit through the interposer;

a bolster plate adjacent to the printed circuit board; and

a fastener configured to secure the bolster plate to the transducer mount such that the printed circuit board, the interposer, and the flexible circuit are compressed between the bolster plate and the transducer mount, wherein the fastener extends through the bolster plate and into the transducer mount, and wherein the bolster plate is configured to hold the printed circuit board in electrical contact with the flexible circuit through the interposer.

2. The ultrasound probe of claim 1 , wherein the bolster plate includes a tab extending from a surface of the bolster plate to the transducer mount, wherein the tab is configured to couple to the transducer mount and the tab having a surface disposed against a side of the transducer mount.

3. The ultrasound probe of claim 2 , wherein the tab includes a first opening and the transducer mount includes a second opening, and wherein the fastener is configured to fit within the first and second openings to couple the bolster plate to the transducer mount.

4. The ultrasound probe of claim 1 , wherein the fastener extends in a plane parallel to a plane of the transducer stack.

5. The ultrasound probe of claim 1 , wherein the fastener is outside an acoustical path of the transducer stack.

6. The ultrasound probe of claim 1 , wherein the fastener is a coil spring pin.

7. The ultrasound probe of claim 3 , wherein the first opening and the second opening are positioned to be offset from each other and aligned when compression is applied to the bolster plate.

8. The ultrasound probe of claim 3 , wherein the second opening is a U-shaped slot.

9. The ultrasound probe of claim 1 , wherein the bolster plate includes a lip extending from a perimeter of the bolster plate and at least partially encloses a portion of the printed circuit board.

10. The ultrasound probe of claim 9 , wherein at least a tab portion of the lip extends to the transducer mount and includes a first opening, and the transducer mount includes a second opening, and wherein the first and second openings are configured to have the fastener fit within the first and second openings to couple the bolster plate to the transducer mount.

11. The ultrasound probe of claim 1 , wherein the transducer mount includes a flange on the lower surface at the second end, wherein the flange is configured to align the printed circuit board with the interposer.

12. The ultrasound probe of claim 1 , further comprising a protective shell configured to surround the bolster plate, printed circuit board, interposer, flexible circuit, transducer mount, and a portion of the transducer stack.

13. The ultrasound probe of claim 12 , wherein the protective shell is configured to secure the bolster plate to the transducer mount.

14. The ultrasound probe of claim 1 , wherein the ultrasound probe is included in an endoscope-type device.

15. The ultrasound probe of claim 10 , wherein the flexible circuit is wrapped around the fastener, the first opening, and the second opening.

16. The ultrasound probe of claim 1 , wherein the fastener is a screw.

17. The ultrasound probe of claim 1 , wherein the transducer mount comprises a width with a first side and an opposite second side, and wherein the fastener extends between the first side to the second side.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 6, 2017
From: CUSCUNA, DINO FRANCESCO
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 042914/0921 →
Continuity (2)
Provisional Application 62102656 · Jan 13, 2015
Related Publication 20180271494A1 · Sep 27, 2018
Cited By (2)
US 12,544,039 US 12,727,856