IP Library › Granted Patent US 12,544,039
Granted Patent B2
US 12,544,039 · App. 17/956,316 · Granted Feb 10, 2026

Interposer electrical interconnect coupling methods, apparatuses, and systems

Inventor: Dino Francesco Cuscuna (Reading, MA)
Assignee: KONINKLIJKE PHILIPS N.V.
A61B8/4494A61B8/0883A61B8/12A61B8/445B06B1/02G01S7/52079G10K11/004
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Quick Facts
Patent No.
US 12,544,039
App. No.
17/956,316
Granted
Feb 10, 2026
Kind
B2
Abstract

Systems, methods, and apparatuses for coupling a flexible circuit to a printed circuit board (PCB) with an interposer in an ultrasound probe are disclosed. A bolster plate configured to compress the PCB, interposer, and flexible circuit against a transducer mount is disclosed. A method of coupling a bolster plate to a transducer mount with fasteners is disclosed. Fasteners that do not pass through the PCB, interposer, and flexible circuit are disclosed.

Claims (9)

1 . A method, comprising:

wrapping a flexible circuit coupled to a transducer stack under a transducer mount coupled to the transducer stack;

positioning an interposer against the flexible circuit;

positioning a printed circuit board against the interposer;

compressing the printed circuit board, interposer, and flexible circuit against the transducer mount with a bolster plate; and

coupling the bolster plate to the transducer mount.

2 . The method of claim 1 , wherein coupling the bolster plate to the transducer mount comprises passing a fastener through the bolster plate and transducer mount.

3 . The method of claim 2 , wherein the fastener is configured to maintain the bolster plate compressing the printed circuit board, interposer, and flexible circuit against the transducer mount.

4 . The method of claim 1 , further comprising dissipating heat from the transducer stack with the bolster plate.

Continuity (3)
Division 15541732
Provisional Application 62102656 · Jan 13, 2015
Related Publication 20230015499A1 · Jan 19, 2023
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