Integrated circuit package and method
In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
1. A device comprising:
a package component comprising:
integrated circuit dies;
an encapsulant around the integrated circuit dies;
a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies;
sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and
a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
2. The device of claim 1 , wherein the support ring has a first portion laterally overlapping the redistribution structure, and a second portion extending beyond the outermost edges of the redistribution structure.
3. The device of claim 1 , wherein the support ring is laterally confined within the outermost edges of the redistribution structure.
4. The device of claim 1 , wherein the support ring has a constant width.
5. The device of claim 1 , wherein the support ring has a width decreasing in a direction extending away from a major surface of the redistribution structure.
6. The device of claim 5 , wherein the width of the support ring decreases linearly.
7. The device of claim 5 , wherein the width of the support ring decreases in steps.
8. The device of claim 1 , wherein the support ring has a non-truncated circular shape.
9. The device of claim 1 , wherein the support ring has a truncated circular shape.
10. The device of claim 1 further comprising:
a mechanical brace physically coupled to the sockets, the support ring laterally surrounding the mechanical brace.
11. The device of claim 10 further comprising:
a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies;
first bolts extending through the mechanical brace, the redistribution structure, the encapsulant, and the thermal module; and
second bolts extending through the support ring, the redistribution structure, the encapsulant, and the thermal module.
12. A device comprising:
a package component comprising:
a redistribution structure having a first diameter;
a support ring attached to an edge of the redistribution structure, the support ring having an inner diameter and an outer diameter, the inner diameter being less than the first diameter, the outer diameter being greater than the inner diameter; and
sockets disposed inside the support ring, the sockets attached to the redistribution structure; and
a mechanical brace on the package component, the mechanical brace disposed inside the support ring.
13. The device of claim 12 further comprising:
bolts fastening the mechanical brace and the support ring to the redistribution structure.
14. The device of claim 12 , wherein a width of the support ring decreases in a direction extending from the package component to the mechanical brace.
15. The device of claim 12 , wherein a width of the support ring is constant in a direction extending from the package component to the mechanical brace.
16. A device comprising:
a mechanical brace;
a thermal module; and
a package component between the thermal module and the mechanical brace, the package component comprising:
an encapsulant;
integrated circuit dies in the encapsulant;
a redistribution structure comprising redistribution lines connected to the integrated circuit dies;
sockets connected to the redistribution lines of the redistribution structure; and
a metal ring attached to the redistribution structure, the metal ring laterally surrounding the sockets and the mechanical brace in a top-down view, the metal ring having a greater Young's modulus than the redistribution structure, the integrated circuit dies, and the encapsulant.
17. The device of claim 16 , wherein the metal ring has a non-truncated circular shape in the top-down view.
18. The device of claim 16 , wherein the metal ring has a truncated circular shape in the top-down view.
19. The device of claim 16 , wherein the metal ring is disposed along outermost edges of the redistribution structure, the metal ring partially overlapping the redistribution structure and partially extending beyond the outermost edges of the redistribution structure.
20. The device of claim 16 , wherein the metal ring is disposed along outermost edges of the redistribution structure, the metal ring completely overlapping the redistribution structure.