Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate having a plurality of pads on a surface of the substrate, a semiconductor chip that includes a plurality of metal bumps connected to corresponding pads on the substrate, a first resin layer between the surface of the substrate and the semiconductor chip, a second resin layer between the substrate and the semiconductor chip and between the first resin layer and at least one of the metal bumps, and a third resin layer on the substrate and above the semiconductor chip.
1. A semiconductor device, comprising:
a substrate having a plurality of pads on a surface of the substrate;
a semiconductor chip that includes a plurality of metal bumps connected to corresponding pads on the substrate;
a first resin layer between the surface of the substrate and the semiconductor chip;
a second resin layer between the substrate and the semiconductor chip and between the first resin layer and at least one of the metal bumps; and
a third resin layer on the substrate and above the semiconductor chip.
2. The semiconductor device according to claim 1 , wherein the metal bumps are on a first surface of the semiconductor chip that faces the substrate.
3. The semiconductor device according to claim 1 , wherein the pads are electrically connected to wires in the substrate.
4. The semiconductor device according to claim 1 , wherein the first and second resin layers include fillers, and a concentration of filler in the second resin layer is greater than a concentration of filler in the first resin layer.
5. The semiconductor device according to claim 1 , wherein a thermal expansion coefficient of the second resin layer is smaller than a thermal expansion coefficient of the first resin layer.
6. The semiconductor device according to claim 1 , wherein an elastic modulus of the second resin layer is larger than an elastic modulus of the first resin layer.
7. The semiconductor device according to claim 1 , wherein the second resin layer covers a part of a side surface of the semiconductor chip and a side surface of at least one of the metal bumps of the plurality of metal bumps.
8. The semiconductor device according to claim 7 , further comprising:
a first insulating material on the substate, wherein
the second resin layer further covers a part of the first insulating material.
9. A manufacturing method of a semiconductor device, comprising:
forming a first resin layer on a semiconductor chip including a metal bump;
aligning the metal bump with a pad on a substrate, and then bonding the first resin layer to a surface of the substrate;
forming a second resin layer between the substrate and the semiconductor chip, the second resin layer including a reducing agent;
heating the substrate and the semiconductor chip such that the metal bump and the pad are connected to each other; and
curing the second resin layer and forming a third resin layer on the substrate and above the semiconductor chip.
10. The manufacturing method according to claim 9 , wherein the first resin layer is photosensitive and patterned using a lithography technique.
11. The manufacturing method according to claim 9 , further comprising:
heating the substrate and the semiconductor chip before forming the second resin layer.
12. The manufacturing method according to claim 11 , wherein the heating before forming the second resin layer, the forming thereof, and the heating thereafter are performed in an uninterrupted series of steps and without exposing the substrate to ambient atmosphere.
13. The manufacturing method according to claim 9 , wherein the heating includes connecting the metal bump and the pad by flip-chip connection.
14. A manufacturing method of a semiconductor device, comprising:
forming a first resin layer on a substrate, the substrate including a pad;
aligning a metal bump of a semiconductor chip with the pad, and bonding the first resin layer to the semiconductor chip;
forming a second resin layer between the substrate and the semiconductor chip, the second resin layer including a reducing agent;
heating the substrate and the semiconductor chip such that the metal bump and the pad are connected to each other; and
curing the second resin layer and forming a third resin layer on the substrate and above the semiconductor chip.
15. The manufacturing method according to claim 14 , wherein the first resin layer is photosensitive and formed using a lithography technique.
16. The manufacturing method according to claim 14 , further comprising:
heating the substrate and the semiconductor chip before forming the second resin layer.
17. The manufacturing method according to claim 16 , wherein the heating before forming the second resin layer, the forming thereof, and the heating thereafter are performed in an uninterrupted series of steps and without exposing the substrate to ambient atmosphere.
18. The manufacturing method according to claim 14 , wherein the heating includes connecting the metal bump and the pad by flip-chip connection.