Filter-centric III-N films enabling RF filter integration with III-N transistors
Disclosed herein are IC structures, packages, and devices that include III-N transistors integrated on the same substrate or die as resonators of RF filters. An example IC structure includes a support structure (e.g., a substrate), a resonator, provided over a first portion of the support structure, and an III-N transistor, provided over a second portion of the support structure. The IC structure includes a piezoelectric material so that first and second electrodes of the resonator enclose a first portion of the piezoelectric material, while a second portion of the piezoelectric material is enclosed between the channel material of the III-N transistor and the support structure. In this manner, one or more resonators of an RF filter may be monolithically integrated with one or more III-N transistors. Such integration may reduce costs and improve performance by reducing RF losses incurred when power is routed off chip.
1. A radio frequency (RF) device, comprising:
a die, the die including:
a first III-N semiconductor material having a first portion and a second portion,
a second III-N semiconductor material over the first portion of the first III-N semiconductor material, wherein a full width half maximum (FWHM) of an X-ray diffraction peak of the first III-N semiconductor material is greater than a FWHM of an X-ray diffraction peak of the second III-N semiconductor material,
an III-N transistor over the second III-N semiconductor material, and
a RF resonator, wherein the second portion of the first III-N semiconductor material is between a first electrode and a second electrode of the RF resonator.
2. The RF device according to claim 1 , further comprising:
a first cavity surrounding at least a portion of the first electrode of the RF resonator, and
a second cavity surrounding at least a portion of the second electrode of the RF resonator.
3. The RF device according to claim 1 , wherein the first III-N semiconductor material is a sputtered III-N semiconductor material.
4. The RF device according to claim 3 , wherein the second III-N semiconductor material is an epitaxially grown III-N semiconductor material.
5. The RF device according to claim 1 , further comprising a third III-N semiconductor material over the second III-N semiconductor material, wherein at least a portion of the third III-N semiconductor material is a channel region of the III-N transistor.
6. The RF device according to claim 1 , wherein the RF resonator is a lamb resonator or a contour-mode resonator.
7. The RF device according to claim 1 , wherein the RF resonator is one of a plurality of RF resonators of a filter bank of the die.
8. The RF device according to claim 7 , wherein the III-N transistor is a part of a switch to turn on and off one or more of the plurality of RF resonators of the filter bank.
9. The RF device according to claim 7 , wherein the III-N transistor is a part of an amplifier coupled to the filter bank.
10. The RF device according to claim 9 , wherein the III-N transistor is one of a plurality of III-N transistors included in the amplifier.
11. The RF device according to claim 9 , wherein the RF device is an RF receiver or an RF transceiver.
12. The RF device according to claim 1 , further comprising an antenna for receiving and transmitting RF signals.
13. The RF device according to claim 1 , wherein the second III-N semiconductor material is an epitaxially grown III-N semiconductor material.
14. A radio frequency (RF) component, comprising:
a first III-N semiconductor material;
a second III-N semiconductor material;
a filter bank, comprising a plurality of RF resonators; and
an III-N transistor, provided on a single die with the filter bank, wherein:
a full width half maximum (FWHM) of an X-ray diffraction peak of the first III-N semiconductor material is greater than a FWHM of an X-ray diffraction peak of the second III-N semiconductor material,
the III-N transistor further includes a polarization material, and
the second III-N semiconductor material is between the polarization material and the first III-N semiconductor material.
15. The RF component according to claim 14 , wherein:
the first III-N semiconductor material includes a sputtered III-N semiconductor material, and
the second III-N semiconductor material includes an epitaxially grown III-N semiconductor material.
16. An electronic device, comprising:
an integrated circuit (IC) die that includes an III-N transistor and a resonator; and
a further component, coupled to the IC die, the further component including one of a carrier substrate, a package substrate, an interposer, or a further IC die,
wherein:
the die includes a first III-N semiconductor material and a second III-N semiconductor material,
the first III-N semiconductor material includes a sputtered III-N semiconductor material,
the second III-N semiconductor material includes an epitaxially grown III-N semiconductor material,
the second III-N semiconductor material is between the III-N transistor and a first portion of the first III-N semiconductor material, and
second portion of the first III-N semiconductor material is a portion of the resonator.
17. The electronic device according to claim 16 , wherein the electronic device is a user equipment device.
18. The electronic device according to claim 16 , wherein the electronic device is a part of a base station.
19. The electronic device according to claim 16 , wherein the second portion of the first III-N semiconductor material is between a first electrode and a second electrode of the resonator.
20. The electronic device according to claim 16 , wherein a full width half maximum (FWHM) of an X-ray diffraction peak of the first III-N semiconductor material is greater than a FWHM of an X-ray diffraction peak of the second III-N semiconductor material.