Semiconductor device having Schottky barrier diode

1. A semiconductor device comprising:

a first electrode;

a second electrode; and

a semiconductor layer provided between the first electrode and the second electrode, the semiconductor layer having a first plane in contact with the first electrode and a second plane in contact with the second electrode, the semiconductor layer including:

a first semiconductor region of a first conductivity type in contact with the first electrode;

a second semiconductor region of a second conductivity type provided between the first plane and the first semiconductor region, the second semiconductor region extending in a first direction parallel to the first plane and in contact with the first electrode;

a third semiconductor region of the second conductivity type provided between the first plane and the first semiconductor region, the third semiconductor region extending in the first direction and in contact with the first electrode;

a fourth semiconductor region of the second conductivity type provided between the first plane and the first semiconductor region, the fourth semiconductor region interposed between the second semiconductor region and the third semiconductor region and the fourth semiconductor region being electrically connected to the first electrode; and

a fifth semiconductor region of the first conductivity type provided between the first semiconductor region and the fourth semiconductor region, a first conductivity type impurity concentration of the fifth semiconductor region being higher than a first conductivity type impurity concentration of the first semiconductor region, the fifth semiconductor region including a first portion that is separated from the first electrode,

wherein a first width of the fourth semiconductor region in a second direction parallel to the first plane and perpendicular to the first direction is larger than a second width of the second semiconductor region in the second direction,

wherein a first distance between the second semiconductor region and the first portion in the second direction is smaller than a second distance between the second semiconductor region and the fourth semiconductor region in the second direction, and

wherein a third width of the first portion in the second direction is smaller than the first width.

2. The semiconductor device according to claim 1 , wherein the fifth semiconductor region further includes a second portion, the first semiconductor region is interposed between the first portion and the second portion, and

wherein a third distance between the third semiconductor region and the second portion in the second direction is smaller than a fourth distance between the third semiconductor region and the fourth semiconductor region in the second direction.

3. The semiconductor device according to claim 2 , wherein a shape of the fifth semiconductor region viewed from a third direction perpendicular to the first plane is an annular shape.

4. The semiconductor device according to claim 2 , further comprising a metal semiconductor compound layer provided between the fourth semiconductor region and the first electrode,

wherein a fifth distance between the first portion and the second portion in the second direction is larger than a fourth width of the metal semiconductor compound layer in the second direction.

5. The semiconductor device according to claim 1 , wherein a sixth distance between the first portion and the first plane is smaller than a depth of the fourth semiconductor region with respect to the first plane as a reference.

6. The semiconductor device according to claim 1 , wherein the semiconductor layer further includes a sixth semiconductor region of the second conductivity type provided between the first plane and the first semiconductor region, the sixth semiconductor region extending in the first direction, the sixth semiconductor region being in contact with the first electrode, and the second semiconductor region being interposed between the fourth semiconductor region and the sixth semiconductor region.

7. The semiconductor device according to claim 6 , wherein the second distance is smaller than a seventh distance between the sixth semiconductor region and the second semiconductor region.

8. The semiconductor device according to claim 1 , wherein the semiconductor layer further includes:

a seventh semiconductor region provided between the first plane and the first semiconductor region and surrounding the second semiconductor region, the third semiconductor region, and the fourth semiconductor region; and

an eighth semiconductor region provided between the first semiconductor region and the seventh semiconductor region and surrounding the second semiconductor region, the third semiconductor region, and the fourth semiconductor region, a first conductivity type impurity concentration of the eighth semiconductor region being higher than the first conductivity type impurity concentration of the first semiconductor region, and

wherein the first conductivity type impurity concentration of the fifth semiconductor region is lower than the first conductivity type impurity concentration of the eighth semiconductor region.

9. The semiconductor device according to claim 1 , wherein the semiconductor layer is a silicon carbide layer.