IP Library › Granted Patent US 11,513,564
Granted Patent B2
US 11,513,564 · App. 16/807,027 · Granted Nov 29, 2022

Casing structure and manufacturing method thereof

Inventor: Chin-Hsien Chang (Taipei, TW)
Assignee: COMPAL ELECTRONICS, INC.
G06F1/1656B29C45/14336B29C45/14467B29K2705/00B29L2031/3481
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Quick Facts
Patent No.
US 11,513,564
App. No.
16/807,027
Granted
Nov 29, 2022
Kind
B2
Abstract

A casing structure including a plastic casing, at least one metal component, and a conductive layer is provided. The at least one metal component is disposed on the plastic casing, and at least one side surface of the at least one metal component is covered by the plastic casing. The conductive layer is disposed on the metal component and extends to the plastic casing. In addition, a manufacturing method of the casing structure is also provided.

Claims (9)

1. A casing structure, comprising:

a plastic casing;

at least one metal component, disposed on the plastic casing, wherein at least one side surface of the at least one metal component is covered by the plastic casing; and

a conductive layer, disposed on the at least one metal component and extending to the plastic casing,

wherein a top surface of the plastic casing and a top surface of the at least one metal component are coplanar and are covered by the conductive layer.

2. The casing structure according to claim 1 , wherein the at least one metal component is disposed on a surface of the plastic casing, the at least one side surface of the at least one metal component adjoins the surface of the plastic casing, the plastic casing has at least one extension wall, and the at least one extension wall extends from the surface of the plastic casing and covers the at least one side surface of the at least one metal component.

3. The casing structure according to claim 2 , wherein the at least one side surface of the at least one metal component is perpendicular to the surface of the plastic casing.

4. The casing structure according to claim 2 , wherein the top surface of the at least one extension wall adjoins the top surface of the at least one metal component, and the top surface of the at least one extension wall is level with the top surface of the at least one metal component.

5. The casing structure according to claim 1 , wherein the at least one metal component is located at a corner area of the plastic casing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2020
From: CHANG, CHIN-HSIEN
To: COMPAL ELECTRONICS, INC.
Reel/Frame 051984/0691 →
Continuity (2)
Provisional Application 62817516 · Mar 12, 2019
Related Publication 20200293091A1 · Sep 17, 2020
Cited By (1)
US 12,189,432