Hybrid assembly of an ultra thin information handling system housing
An information handling system housing is formed to provide a reduced overall material thickness by forming a planar housing piece of a first metal, such as aluminum, with an interior surface having channels of reduced thickness and laser sintering a pattern in the channel with a second material, such as a pattern of interconnected hexagons formed by lines of steel. Locally formed shapes of components disposed in the housing, such as battery shape, provide room for the components with improved stiffness of the housing to meet structural constraints.
1. A method for manufacture of a housing of an information handling system, the method comprising:
forming the housing of the information handling system from a planar plate of a first metal to have an outer perimeter of a first thickness and a central region of a second thickness of less than the first thickness; and
laser sintering a pattern onto the central region with a second metal, the pattern having plural interconnected shapes formed by lines of the second metal.
2. The method of claim 1 wherein the pattern comprises plural hexagons.
3. The method of claim 2 wherein the first metal comprises aluminum and the second metal comprises stainless steel.
4. The method of claim 1 further comprising:
locating the central region at a placement location of a component of the information handling system, the central region having a perimeter of slightly greater than a perimeter of the component; and
assembling the housing to enclose the component aligned with the central region.
5. The method of claim 4 wherein the component comprises a battery.
6. The method of claim 1 further comprising:
locating the central region at a palm rest of a keyboard cover; and
assembling the housing to cover a keyboard.
7. The method of claim 1 further comprising:
coupling a carbon fiber composite frame to a perimeter of the housing; and
assembling a display in the housing within the carbon fiber composite frame.
8. The method of claim 1 further comprising integrating copper with the second metal.