Printed circuit board
A printed circuit board according to an embodiment includes: an insulating layer; and a circuit pattern disposed on the insulating layer, wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.31 μm.
1. A printed circuit board comprising:
an insulating layer; and
a circuit pattern disposed on the insulating layer,
wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface, and
wherein a surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.17 μm or less.
2. The printed circuit board of claim 1 , wherein the surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.1 μm to 0.13 μm.
3. The printed circuit board of claim 2 , wherein a length of the upper surface is a width of the upper surface,
wherein a length of the lower surface is a width of the lower surface, and
wherein a length of the first side surface and a length of the second side surface are a height of the circuit pattern.
4. The printed circuit board of claim 1 , wherein at least one of a length of the upper surface and a length of the lower surface in a cross section in a width direction of the circuit pattern is different from at least one of a length of the first side surface and a length of the second side surface in the cross section of the circuit pattern,
wherein the surface roughness Ra of at least one of the upper and lower surfaces of the circuit pattern is different from the surface roughness Ra of at least one of the first side surface and the second side surface of the circuit pattern.
5. The printed circuit board of claim 4 , wherein at least one of the length of the upper surface and the length of the lower surface in the cross section of the circuit pattern is greater than at least one of the length of the first side surface and the length of the second side surface in the cross section of the circuit pattern, and
wherein the surface roughness Ra of at least one of the upper and lower surfaces of the circuit pattern is smaller than the surface roughness Ra of at least one of the first side surface and the second side surface of the circuit pattern.
6. The printed circuit board of claim 1 , wherein the surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.42 μm or less.
7. The printed circuit board of claim 1 , wherein the circuit pattern comprises:
a plating seed layer disposed on the insulating layer; and
a pattern layer disposed on the plating seed layer.
8. The printed circuit board of claim 7 , wherein the upper surface of the circuit pattern is an upper surface of the pattern layer,
wherein the lower surface of the circuit pattern is a lower surface of the plating seed layer,
wherein the first side surface of the circuit pattern includes a first side surface of the plating seed layer and a first side surface of the pattern layer, and
wherein the second side surface of the circuit pattern includes a second side surface of the plating seed layer and a second side surface of the pattern layer.
9. The printed circuit board of claim 1 , wherein a length of the upper surface in a cross-section in a width direction of the circuit pattern is smaller than a length of the lower surface in the cross-section in the width direction of the circuit pattern.
10. The printed circuit board of claim 9 , wherein at least one of the first side surface and the second side surface in the cross-section in the width direction of the circuit pattern has a predetermined inclination angle and connects between the upper surface and the lower surface of the circuit pattern.
11. A printed circuit board comprising:
an insulating layer; and
a circuit pattern disposed on the insulating layer,
wherein the circuit pattern includes an upper surface, a lower surface, a first side surface, and a second side surface,
wherein a surface roughness Ra of at least three surfaces of the upper surface, the lower surface, the first side surface, and the second side surface of the circuit pattern is 0.31 μm or less, and
wherein an impedance of the circuit pattern is 35.3Ω or less.