IP Library Granted Patent US 11,538,715
Granted Patent B2
US 11,538,715 · App. 16/643,263 · Granted Dec 27, 2022

Stage and substrate processing apparatus

Inventors: Ryo Chiba (Miyagi, JP); Yasuharu Sasaki (Miyagi, JP); Akira Nagayama (Miyagi, JP)
Assignee: TOKYO ELECTRON LIMITED
H01L21/68735H01L21/68742H01L21/68785
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Quick Facts
Patent No.
US 11,538,715
App. No.
16/643,263
Granted
Dec 27, 2022
Kind
B2
Abstract

The present invention provides a stage which comprises: a plate-shaped member having a mounting surface on which a workpiece to be processed is mounted and a rear surface facing the mounting surface, said plate-shaped member being provided with a through hole that penetrates through the mounting surface and the rear surface; and an embedded member disposed inside the through hole. This stage is configured such that the surface of the embedded member is provided with at least one of a concave portion and a convex portion.

Claims (22)

1. A stage comprising:

a plate-shaped member having a mounting surface on which a workpiece is mounted, a rear surface facing the mounting surface, and a through hole penetrating through the mounting surface and the rear surface; and

an embedded member disposed inside the through hole,

wherein at least one of a concave portion and a convex portion is provided on a surface of the embedded member,

wherein the at least one of the concave portion and the convex portion on the surface of the embedded member includes a plurality of protrusions and a spiral protrusion, and

wherein the embedded member includes one of the plurality of protrusions and the spiral protrusion in a tip end portion of the embedded member, and includes the other of the plurality of protrusions and the spiral protrusion in a base end portion of the embedded member.

2. The stage of claim 1 , wherein an inner wall of the through hole and the embedded member are spaced apart from each other by a predetermined distance or less in a plan view.

3. The stage of claim 2 , wherein the plurality of protrusions are arranged at intervals of 1.2 mm or less in a circumferential direction.

4. The stage of claim 1 , wherein the plurality of protrusions are alternately formed in two or more layers.

5. The stage of claim 1 , wherein the plurality of protrusions are arranged at intervals of 1.2 mm or less in a circumferential direction.

6. The stage of claim 2 , wherein the predetermined distance is 0.05 mm or less.

7. The stage of claim 1 , wherein at least one of the concave portion and the convex portion on the surface of the embedded member is a concave portion or a convex portion having a width of 0.05 mm or less in a radial direction.

8. The stage of claim 1 , wherein the through hole is a heat transfer gas flow path or a hole through which a lifter pin configured to hold the workpiece is inserted.

9. A substrate processing apparatus comprising:

a processing container configured to process a workpiece therein; and

a stage disposed in the processing container and configured to mount the workpiece,

wherein the stage includes:

a plate-shaped member having a mounting surface on which the workpiece is mounted, a rear surface facing the mounting surface, and a through hole penetrating through the mounting surface and the rear surface; and

an embedded member disposed inside the through hole, and

at least one of a concave portion and a convex portion is provided on a surface of the embedded member,

wherein the at least one of the concave portion and the convex portion on the surface of the embedded member includes a plurality of protrusions and a spiral protrusion, and

wherein the embedded member includes one of the plurality of protrusions and the spiral protrusion in a tip end portion of the embedded member, and includes the other of the plurality of protrusions and the spiral protrusion in a base end portion of the embedded member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 2, 2020
From: CHIBA, RYO; SASAKI, YASUHARU; NAGAYAMA, AKIRA
To: TOKYO ELECTRON LIMITED
Reel/Frame 051977/0859 →
Priority Claims (1)
JP JP2018-116230 · Jun 19, 2018 · national
Continuity (1)
Related Publication 20200335384A1 · Oct 22, 2020