Reflective mask blank, reflective mask, method of manufacturing reflective mask, and method of manufacturing semiconductor device
Provided is a reflective mask blank with which it is possible to further reduce the shadowing effect of a reflective mask, and also possible to form a fine and highly accurate phase-shift pattern. A reflective mask blank having, in the following order on a substrate, a multilayer reflective film and a phase-shift film that shifts the phase of EUV light, said reflective mask blank characterized in that: the phase-shift film has a first layer and a second layer; the first layer comprises a material that contains at least one element from among tantalum (Ta) and chromium (Cr); and the second layer comprises a metal-containing material that contains ruthenium (Ru) and at least one element from among chromium (Cr), nickel (Ni), cobalt (Co), vanadium (V), niobium (Nb), molybdenum (Mo), tungsten (W), and rhenium (Re).
1. A reflective mask blank comprising:
a substrate;
a multilayer reflective film on the substrate; and
on the multilayer reflective film, a phase shift film for shifting a phase of EUV light,
wherein the phase shift film comprises a first layer and a second layer, the first layer comprises at least one selected from of tantalum (Ta) and chromium (Cr), and the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), nickel (Ni), vanadium (V), and tungsten (W).
2. The reflective mask blank according to claim 1 , wherein the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), and nickel (Ni).
3. The reflective mask blank according to claim 1 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing ruthenium (Ru), and the first layer and the second layer are layered in this order on the protective film.
4. The reflective mask blank according to claim 1 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing silicon (Si) and oxygen (O), and the second layer and the first layer are layered in this order on the protective film.
5. A reflective mask comprising:
a substrate;
a multilayer reflective film on the substrate; and
a phase shift pattern on the multilayer reflective film, wherein
the phase shift pattern is obtained by patterning a phase shift film for shifting a phase of EUV light, and the phase shift film comprises a first layer and a second layer, the first layer comprises at least one selected from tantalum (Ta) and chromium (Cr), and the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), nickel (Ni), vanadium (V), and tungsten (W).
6. A method of manufacturing a reflective mask, the method comprising:
forming a phase shift pattern by patterning a second layer by a dry etching gas comprising a chlorine-based gas and an oxygen gas and then by patterning a first layer by a dry etching gas comprising a halogen-based gas comprising no oxygen gas, wherein, a reflective mask blank comprises a multilayer reflective film and a phase shift film for shifting a phase of EUV light on a substrate in this order, and the phase shift film comprises the first layer and the second layer, the first layer comprises tantalum (Ta), and the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), nickel (Ni), vanadium (V), and tungsten (W).
7. A method of manufacturing a reflective mask,
wherein the first layer in the reflective mask blank according to claim 1 comprises chromium (Cr), and a phase shift pattern is formed by patterning the second layer by a dry etching gas comprising an oxygen gas and then by patterning the first layer with a dry etching gas comprising a chlorine-based gas comprising no oxygen gas.
8. A method of manufacturing a reflective mask,
wherein the first layer in the reflective mask blank according to claim 1 comprises chromium (Cr), and a phase shift pattern is formed by patterning the second layer and the first layer by a dry etching gas comprising a chlorine-based gas and an oxygen gas.
9. A method of manufacturing a semiconductor device, the method comprising the reflective mask according to claim 5 in an exposure apparatus comprising an exposure light source that emits EUV light, and transferring a transfer pattern to a resist film formed on a transferred substrate.
10. The reflective mask according to claim 5 , wherein the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), and nickel (Ni).
11. The reflective mask according to claim 5 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing ruthenium (Ru), and the first layer and the second layer are layered in this order on the protective film.
12. The reflective mask according to claim 5 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing silicon (Si) and oxygen (O), and the second layer and the first layer are layered in this order on the protective film.
13. The method of manufacturing a reflective mask according to claim 6 , wherein the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), and nickel (Ni).
14. The method of manufacturing a reflective mask according to claim 6 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing ruthenium (Ru), and the first layer and the second layer are layered in this order on the protective film.
15. The method of manufacturing a reflective mask according to claim 7 , wherein the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), and nickel (Ni).
16. The method of manufacturing a reflective mask according to claim 7 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing silicon (Si) and oxygen (O), and the second layer and the first layer are layered in this order on the protective film.
17. The method of manufacturing a reflective mask according to claim 8 , wherein the second layer comprises ruthenium (Ru) and at least one selected from chromium (Cr), and nickel (Ni).
18. The method of manufacturing a reflective mask according to claim 8 , further comprising a protective film between the multilayer reflective film and the phase shift film, wherein the protective film is made of a material containing silicon (Si) and oxygen (O), and the second layer and the first layer are layered in this order on the protective film.