Advanced electronic device structures using semiconductor structures and superlattices

1. A method of forming a semiconductor structure, comprising:

growing along a growth axis a first superlattice having a plurality of first unit cells and a first polar crystal structure, the growth axis being substantially parallel to a spontaneous polarization axis of the first polar crystal structure;

growing along the growth axis a second superlattice contiguous with the first superlattice, wherein the second superlattice has a plurality of second unit cells and a second polar crystal structure, the growth axis being substantially parallel to a spontaneous polarization axis of the second polar crystal structure;

changing an average composition of the second unit cells of the second superlattice monotonically from a first average composition corresponding to a first wider band gap (WBG) material to a second average composition corresponding to a first narrower band gap (NBG) material or from a third average composition corresponding to a second NBG material to a fourth average composition corresponding to a second WBG material along the growth axis to induce p-type or n-type conductivity; and

growing along the growth axis a third superlattice contiguous with the second superlattice, wherein the third superlattice has a plurality of third unit cells and a third polar crystal structure, the growth axis being substantially parallel to a spontaneous polarization axis of the third polar crystal structure;

wherein the first, second and third unit cells of the first, second and third superlattices respectively each comprise a plurality of at least two distinct layers formed of substantially single crystal semiconductors.

2. The method of claim 1 , wherein the p-type conductivity of the second superlattice is induced by:

growing the second superlattice with a cation-polar crystal structure and changing the average composition of the second unit cells in the second superlattice monotonically from the first average composition to the second average composition along the growth axis; or

growing the second superlattice with an anion-polar crystal structure and changing the average composition of the second unit cells in the second superlattice monotonically from the third average composition to the fourth average composition corresponding to a WBG material along the growth axis.

3. The method of claim 2 , wherein:

the anion-polar crystal structure is a nitrogen-polar crystal structure or an oxygen-polar crystal structure; and

the cation-polar crystal structure is a metal-polar crystal structure.

4. The method of claim 1 , wherein the n-type conductivity of the second superlattice is induced by:

growing the second superlattice with a cation-polar crystal structure and changing the average composition of the second unit cells in the second superlattice monotonically from the third average composition to the fourth average composition along the growth axis; or

growing the second superlattice with an anion-polar crystal structure and changing the average composition of the second unit cells in the second superlattice monotonically from the first average composition to the second average composition along the growth axis.

5. The method of claim 4 , wherein:

the cation-polar crystal structure is a metal-polar crystal structure; and

the anion-polar crystal structure is a nitrogen-polar crystal structure or an oxygen-polar crystal structure.

6. The method of claim 5 , wherein:

the first superlattice is doped n-type and the third superlattice is doped p-type, or the first superlattice is doped p-type and the third superlattice is doped n-type; and

impurity dopants are included in one or more of the at least two distinct layers of the first and third unit cells of the first and third superlattices respectively.

7. The method of claim 5 , further comprising:

forming ohmic metal contacts to the semiconductor structure; and

forming an optical window to form a light emitting diode (LED) device.

8. The method of claim 1 , wherein the average composition of the second unit cells in the second superlattice is changed in a stepwise manner along the growth axis.

9. The method of claim 1 , wherein the average composition of the second unit cells in the second superlattice is changed by changing a thickness of one or more of the at least two distinct layers of the second unit cells in the second superlattice.

10. The method of claim 1 , wherein a thickness of the second unit cells in the second superlattice is constant along the growth axis.

11. The method of claim 1 , wherein a composition of one or more of the at least two distinct layers of the first, second or third unit cells in the first superlattice, the second superlattice, or the third superlattice respectively is selected from the following:

gallium nitride (GaN);

aluminium nitride (AlN);

aluminium gallium nitride (Al x Ga 1-x N) where 0≤x≤1;

boron aluminium nitride B x Al 1-x N where 0≤x≤1; and

aluminium gallium indium nitride (Al x Ga y-x-y N) where 0≤x≤1, 0≤y≤1 and 0≤(x+y)≤1.

12. The method of claim 1 , wherein a composition of one or more of the at least two distinct layers of the first, second or third unit cells in the first superlattice, the second superlattice, or the third superlattice is selected from the following:

magnesium oxide (MgO);

zinc oxide (ZnO); and

magnesium zinc oxide (Mg x Zn 1-x O) where 0≤x≤1.

13. The method of claim 1 , wherein the at least two distinct layers of each unit cell each have a thickness that is less than a de Broglie wavelength of a charge carrier in the respective layer.

14. The method of claim 1 , wherein the at least two distinct layers of each unit cell each have a thickness that is less than or equal to a critical layer thickness required to maintain elastic strain.

15. The method of claim 1 , wherein:

impurity dopants are included in one or more of the at least two distinct layers of each of the second unit cells of the second superlattice to enhance the induced p-type or n-type conductivity.

16. The method of claim 1 , further comprising flipping a polarity-type of material between the first superlattice and the second superlattice, or between the second superlattice and the third superlattice.

17. The method of claim 1 , wherein a buffer or dislocation filter region is grown on a substrate preceding the first superlattice.

18. The method of claim 17 , wherein:

the substrate is selected as a sapphire (Al 2 O 3 ) substrate, an aluminium nitride (AlN) substrate, a silicon substrate, or a gallium nitride (GaN) substrate.