Electronic device comprising wire links
An integrated circuit chip is attached to a support that includes first conductive elements. First conductive pads are located on the integrated circuit chip and are electrically coupled to the first conductive elements by conductive wires. The integrated circuit chip further includes a conductive track. A switch circuit is provided to selectively electrically connect each first conductive pad to the conductive track. To test the conductive wires, a group of first conductive pads are connected by their respective switch circuits to the conductive track and current flow between corresponding first conductive elements is measured.
1. A device, comprising:
a support including first conductive elements located on a first surface of the support;
an integrated circuit chip attached to the support, the integrated circuit chip including first conductive pads;
conductive wires coupling the first conductive pads to the first conductive elements;
a conductive track located on the integrated circuit chip; and
switching circuitry including a plurality of switch circuits, each switch circuit configured to selectively connect one of the first conductive pads to the conductive track.
2. The device according to claim 1 , wherein the integrated circuit chip is covered with a protection layer that also covers the first conductive elements and the conductive wires.
3. The device according to claim 1 , further comprising second conductive elements located on a second surface of the support and electrically connected through the support to the first conductive elements.
4. The device according to claim 1 , further comprising one or more second conductive pads located on the integrated circuit chip, wherein each second conductive pad is coupled to one of the first conductive elements by one of the conductive wires.
5. The device according to claim 4 , wherein the one or more second conductive pads are electrically connected to the switching circuitry and are further configured to supply signaling for controlling actuation and deactuation of each switch circuit of the plurality of switch circuits.
6. The device according to claim 5 , wherein said one or more second conductive pads comprise a first one of the second conductive pads configured to receive a reference voltage and a second one of the second conductive pads configured to receive a control voltage for controlling actuation and deactuation of each switch circuit of the plurality of switch circuits.
7. The device according to claim 5 , wherein said one or more second conductive pads comprise a first one of the second conductive pads configured to receive a clock signal and a second one of the second conductive pads configured to receive a control voltage for controlling actuation and deactuation of each switch circuit.
8. The device according to claim 4 , wherein there are as many first and second conductive pads as there are first conductive elements.
9. The device according to claim 1 , wherein the first conductive pads are input/output pads of the integrated circuit chip.
10. The device according to claim 1 , wherein the conductive track forms a ring.
11. A method of testing a device which includes: an integrated circuit chip attached to a support; first conductive elements located on a first surface of the support; first conductive pads located on the integrated circuit chip, the first conductive pads being coupled to the first conductive elements by conductive wires; a conductive track located on the integrated circuit chip; and switching circuitry including switch circuits configured to selectively connect each first conductive pad to the conductive track, the method comprising:
actuating switch circuits associated with a group which includes at least two first conductive pads and deactuating all other switch circuits;
supplying a current to the first conductive element coupled to one of the first conductive pads in the group; and
measuring current flowing through the first conductive elements coupled to at least one of the other first conductive pads in the group.
12. The method of claim 11 , further comprising repeating with a different group.
13. The method of claim 12 , wherein the at least two first conductive pads of each group are different for each repeat.
14. The method of claim 11 , further comprising repeating such that each first conductive pad forms part of at least one of the groups.
15. The method according to claim 14 , wherein a same one of the first conductive pads receives the current for all groups.
16. The method according to claim 14 , wherein each group includes different ones of the first conductive pads.
17. The method according to claim 11 , wherein the group comprises two first conductive pads.
18. The method according to claim 11 , wherein the device further includes second conductive elements located on a second surface of the support and electrically connected through the support to the first conductive elements, and wherein supplying the current and measuring current are performed with respect to at least one of the second conductive elements.