Technologies for on-circuit board de-embedding
Technologies for on-circuit board de-embedding are disclosed. In the illustrative embodiment, several micromechanical relays on a circuit board can connect a trace on the circuit board to an open circuit, a closed circuit, a load circuit, or a through circuit. For the through circuit, the trace is connected to an integrated circuit component mounted on the circuit board. A cable is connected to the trace, allowing for signals to be sent to any of the four circuits without any probes connected to the circuit board. The transmitted and/or reflected signals can be measured, which can be used to de-embed the integrated circuit component.
1. A system comprising:
a circuit board comprising:
a connector to mate with a cable;
a trace connected to the connector; and
one or more micromechanical switches to switch the trace between (i) a short circuit, (ii) an open circuit, (iii) a load circuit, and (iv) a through circuit.
2. The system of claim 1 , further comprising an integrated circuit component mated with the circuit board, wherein the one or more micromechanical switches are configurable to switch the trace to the integrated circuit component.
3. The system of claim 2 , further comprising a plurality of wire bonds, wherein individual wire bonds of the plurality of wire bonds connect a pad on the circuit board to a pad on the integrated circuit component.
4. The system of claim 2 , wherein the integrated circuit component is mounted on the circuit board using one or more solder bumps, wherein the one or more micromechanical switches are configurable to switch the trace to one of the one or more solder bumps.
5. The system of claim 1 , further comprising a vector network analyzer connected to the cable, wherein the vector network analyzer is to send one or more electrical signals to the cable and measure a transmitted and reflected signal.
6. The system of claim 1 , wherein individual micromechanical switches of the one or more micromechanical switches are single-pole double-throw switches.
7. The system of claim 1 , wherein individual micromechanical switches of the one or more micromechanical switches are electrically-controlled relays.
8. The system of claim 1 , wherein individual micromechanical switches of the one or more micromechanical switches are manually-toggled switches.
9. The system of claim 1 , wherein the one or more micromechanical switches comprise a single-pole multi-throw switch with four outputs.
10. The system of claim 1 , wherein the one or more micromechanical switches are to switch the trace between (i) the short circuit, (ii) the open circuit, (iii) the load circuit, and (iv) the through circuit in a cryogenic refrigerator at a temperature below 20 Kelvin.
11. A method comprising:
configuring one or more switches on a circuit board to a plurality of configurations, wherein individual configurations of the plurality of configurations connect a trace on the circuit board to different individual components of a plurality of components, wherein configuring the one or more switches comprises switching the trace between (i) a short circuit, (ii) an open circuit, (iii) a load circuit, and (iv) a through circuit;
providing, for individual configurations of the plurality of configurations, an electrical signal to the trace;
measuring, for individual configurations of the plurality of configurations, one or more parameters that result from the provided electrical signal; and
de-embedding an integrated circuit component electrically connected to the circuit board based on the one or more parameters for individual configurations of the plurality of configurations.
12. The method of claim 11 , wherein the plurality of components comprises an open circuit, a short circuit, a load circuit, and a through circuit, wherein the through circuit comprises at least part of the integrated circuit component.
13. The method of claim 11 , wherein de-embedding the integrated circuit component comprises determining two-port scattering parameters of the integrated circuit component.
14. The method of claim 11 , wherein de-embedding the integrated circuit component comprises de-embedding the integrated circuit component without using measurements of a probe on a trace of the circuit board.
15. The method of claim 11 , wherein measuring, for individual configurations of the plurality of configurations, the one or more parameters that result from the provided electrical signal comprises measuring, for individual configurations of the plurality of configurations, the one or more parameters that result from the provided electrical signal while the circuit board and the integrated circuit component are inside of a cryogenic refrigerator and are at a temperature less than 20 Kelvin.
16. The method of claim 11 , further comprising connecting a cable to a vector network analyzer and to a connector on the circuit board, wherein the trace is connected to the connector,
wherein providing, for individual configurations of the plurality of configurations, the electrical signal to the trace comprises providing, for individual configurations of the plurality of configurations and by the vector network analyzer, the electrical signal to the trace,
wherein measuring, for individual configurations of the plurality of configurations, the one or more parameters comprises measuring, for individual configurations of the plurality of configurations, the one or more parameters by the vector network analyzer.
17. The method of claim 11 , wherein individual switches of the one or more switches are micromechanical switches.
18. A system comprising:
a circuit board;
an integrated circuit component; and
means for determining parameters for de-embedding the integrated circuit component.
19. The system of claim 18 , wherein the means for determining the parameters for de-embedding the integrated circuit component comprises one or more micromechanical switches to switch a trace of the circuit board between (i) a short circuit, (ii) an open circuit, (iii) a load circuit, and (iv) a through circuit.
20. The system of claim 18 , wherein the means for determining parameters for de-embedding the integrated circuit component comprises means for determining parameters for de-embedding the integrated circuit component without using a probe connected to a trace on the circuit board.
21. The system of claim 18 , further comprising a plurality of wire bonds, wherein individual wire bonds of the plurality of wire bonds connect a pad on the circuit board to a pad on the integrated circuit component.
22. The system of claim 18 , wherein the means for determining the parameters for de-embedding the integrated circuit component comprising a vector network analyzer connected to a cable, wherein the cable is connected to a connector on the circuit board, wherein the vector network analyzer is to send one or more electrical signals to the cable and measure a transmitted and reflected signal.
23. The system of claim 18 , wherein the means for determining the parameters for de-embedding the integrated circuit component comprise one or more micromechanical switches.
24. The system of claim 23 , wherein the one or more micromechanical switches are configurable to switch a trace of the circuit board to the integrated circuit component.
25. The system of claim 23 , wherein the one or more micromechanical switches are to switch a trace of the circuit board between (i) a short circuit, (ii) an open circuit, (iii) a load circuit, and (iv) a through circuit in a cryogenic refrigerator at a temperature below 20 Kelvin.