IP Library › Granted Patent US 11,592,741
Granted Patent B2
US 11,592,741 · App. 17/005,266 · Granted Feb 28, 2023

Imprinting method, semiconductor device manufacturing method and imprinting apparatus

Inventors: Takeshi Higuchi (Yokohama Kanagawa, JP); Hirokazu Kato (Kariya Aichi, JP); Kasumi Okabe (Yokohama Kanagawa, JP)
Assignee: Kioxia Corporation
G03F7/0002G03F7/162H01L21/0271
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Quick Facts
Patent No.
US 11,592,741
App. No.
17/005,266
Granted
Feb 28, 2023
Kind
B2
Abstract

An imprinting method includes dispensing a first liquid on a first region of a substrate. The first liquid is a photocurable resist precursor. A second liquid is dispensed on a second region of the substrate. The second region is adjacent to and surrounding the first region. The second liquid is non-photocurable as dispensed. The first region is then irradiated with light while a patterned template is being pressed against the first liquid. The light cures the first liquid and forms a resist pattern corresponding to the patterned template. The patterned template and the substrate are then separated from each other. The second liquid is then selectively removed from the substrate while leaving the resist pattern on the substrate.

Claims (17)

1. An imprinting method, comprising;

dispensing a first liquid on a first region of a substrate, the first liquid being a photocurable resist precursor, and the first region being an inner portion of a shot region that is one of a plurality of die areas on the substrate;

dispensing a second liquid on a second region of the substrate, the second region being adjacent to and surrounding the first region, the second region being an outer portion of the shot region, and the second liquid being non-photocurable as dispensed;

irradiating the first region with light while pressing a patterned template against the first liquid to cure the first liquid and form a resist pattern corresponding to the patterned template;

separating the patterned template and the substrate; and

selectively removing the second liquid from the substrate while leaving the resist pattern on the substrate.

2. The imprinting method according to claim 1 , wherein the second liquid is coated on the substrate before the dispensing of the first liquid.

3. The imprinting method according to claim 2 , wherein the second liquid is a saturated hydrocarbon.

4. The imprinting method according to claim 2 , wherein the second liquid is an unsaturated hydrocarbon.

5. The imprinting method according to claim 4 , wherein the unsaturated hydrocarbon is an oligomer having a polymerizable end group.

6. The imprinting method according to claim 1 , wherein the second liquid is a saturated hydrocarbon.

7. The imprinting method according to claim 1 , wherein the second liquid is an unsaturated hydrocarbon.

8. The imprinting method according to claim 7 , wherein the second liquid includes a photopolymerization inhibitor.

9. The imprinting method according to claim 7 , wherein the unsaturated hydrocarbon is an oligomer having a polymerizable end group.

10. The imprinting method according to claim 1 , wherein the second liquid includes a photopolymerization inhibitor.

11. The imprinting method according to claim 1 , wherein the second liquid is selectively removed from the substrate by vacuum-assisted evaporation.

12. The imprinting method according to claim 1 , wherein the second liquid is selectively removed from the substrate in a solvent wash process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 1, 2022
From: HIGUCHI, TAKESHI; KATO, HIROKAZU; OKABE, KASUMI
To: KIOXIA CORPORATION
Reel/Frame 060065/0766 →
Priority Claims (1)
JP JP2019-163414 · Sep 6, 2019 · national
Continuity (1)
Related Publication 20210072640A1 · Mar 11, 2021