Semiconductor device including back side power supply circuit

1. A semiconductor device, comprising:

a substrate;

a front side circuit disposed over a front surface of the substrate; and

a backside power delivery circuit disposed over a back surface of the substrate and including a first back side power supply wiring, wherein:

the front side circuit includes:

a plurality of power supply wirings including a first power supply wiring and a second power supply wiring; and

a power switch configured to electrically connect and disconnect the first power supply wiring and the second power supply wiring, and

the second power supply wiring is connected to the first back side power supply wiring by a first through-silicon via (TSV) passing through the substrate.

2. The semiconductor device of claim 1 , wherein:

the backside power delivery circuit includes a second back side power supply wiring,

the plurality of power supply wirings further includes a third power supply wiring, and

the third power supply wiring is connected to the second back side power supply wiring by a second TSV passing through the substrate.

3. The semiconductor device of claim 2 , wherein:

the plurality of power supply wirings extend in a first direction, and

the second power supply wiring is separated from and aligned with the third power supply wiring in the first direction.

4. The semiconductor device of claim 3 , further comprising a power switch area and a logic circuit area, wherein:

the power switch area includes the power switch, the second power supply wiring and the first TSV,

the logic circuit area includes the third power supply wiring and the second TSV, and

the first power supply wiring is continuously disposed in the power switch area and the logic circuit area.

5. The semiconductor device of claim 4 , wherein no TSV is connected to the first power supply wiring.

6. The semiconductor device of claim 4 , wherein:

the power switch area includes only one conductivity type fin field effect transistors (FinFETs), and

the logic circuit area includes a CMOS circuit comprising FinFETs.

7. The semiconductor device of claim 6 , wherein:

the plurality of power supply wirings extend in the first direction, and

the second power supply wiring is separated from and is not aligned with the third power supply wiring in the first direction in plan view.

8. The semiconductor device of claim 7 , wherein:

one of a plurality of semiconductor fins in the FinFETs in the power switch area is aligned with the third power supply wiring in the first direction in plan view.

9. The semiconductor device of claim 1 , wherein:

the power switch includes a fin field effect transistor (FinFET), and

a source of the FinFET is connected to the second power supply wiring and a drain of the FinFET is connected to the first power supply wiring.

10. A semiconductor device, the semiconductor device comprising:

a substrate; and

a front side circuit disposed over a front surface of the substrate, a front side insulating layer being disposed over the front surface, wherein:

the front side circuit includes:

a plurality of buried power supply wirings embedded in the first front side insulating layer and extending in a first direction, the plurality of buried power supply wirings including a first buried power supply wiring, a pair of second buried power supply wirings sandwiching the first buried power supply wiring, a third buried power supply wiring, and a pair of fourth buried power supply wirings sandwiching the third buried power supply wiring; and

a power switch configured to electrically connect and disconnect the first buried power supply wiring and the pair of second buried power supply wirings,

the pair of second buried power supply wirings are separated from the pair of fourth buried power supply wirings, respectively, and

the first buried power supply wiring and the third buried power supply wirings form one continuously extending wiring.

11. The semiconductor device of claim 10 , wherein the pair of second buried power supply wirings are aligned with the pair of fourth buried power supply wirings in the first direction, respectively.

12. The semiconductor device of claim 11 , further comprising:

a backside power delivery circuit disposed over a back surface of the substrate and including a first back side power supply wiring and a second back side power supply wiring, wherein:

the second buried power supply wiring is connected to the first back side power supply wiring by a first through-silicon via (TSV) passing through the substrate, and

the third buried power supply wiring is connected to the second back side power supply wiring by a second TSV passing through the substrate.

13. The semiconductor device of claim 12 , wherein:

two or more fin structures for FETs having a same conductivity type are arranged along a second direction crossing the first direction between the first buried power supply wiring and one of the pair of second buried power supply wirings,

two or more fin structures for FETs having different conductivity types are arranged along the second direction between the third buried power supply wiring and one of the pair of fourth buried power supply wirings.

14. The semiconductor device of claim 13 , wherein the two or more fin structures for the FETs having a same conductivity type are aligned in the first direction with the two or more fin structures for the FETs having different conductivity types, respectively.

15. The semiconductor device of claim 13 , wherein one of the two or more fin structures for the FETs having a same conductivity type is not aligned in the first direction with none of the two or more fin structures for the FETs having different conductivity types.

16. The semiconductor device of claim 13 , wherein one of the two or more fin structures for the FETs having different conductivity types is coupled to the third buried power supply wiring.

17. The semiconductor device of claim 16 , wherein another one of the two or more fin structures for the FETs having different conductivity types is coupled to the one of the pair of fourth buried power supply wirings.

18. The semiconductor device of claim 10 , wherein a distance between one of the pair of second buried power supply wirings and the first buried power supply wiring is smaller than a distance between one of the pair of fourth buried power supply wirings and the third buried power supply wiring.

19. A semiconductor device including comprising:

a substrate;

a front side circuit disposed over a front surface of the substrate; and

a backside power delivery circuit disposed over a back surface of the substrate and including a back side power supply wiring, wherein:

the front side circuit includes:

a first fin structure comprising a source region and a drain region;

a gate structure disposed over the first fin structure;

a buried power supply wiring; and

a conductive connection pattern connecting one of the source region or the drain region to the buried power supply line, and

the buried power supply wiring is connected to the back side power supply wiring by a through-silicon via (TSV) passing through the substrate.

20. The semiconductor device of claim 19 , wherein:

the front side circuit further includes a second fin structure comprising a source region and a drain region,

the buried power supply wiring is disposed between the first fin structure and the second fin structure in plan view, and

the conductive connection pattern connects one of the source region or the drain region of the second fin structure to the buried power supply line.