IP Library › Granted Patent US 12,588,278
Granted Patent B2
US 12,588,278 · App. 17/838,090 · Granted Mar 24, 2026

Semiconductor device having different size active regions and method of making

Inventors: Jiann-Tyng Tzeng (Hsinchu, TW); Kam-Tou Sio (Hsinchu, TW); Shang-Wei Fang (Hsinchu, TW); Chun-Yen Lin (Hsinchu, TW); Sheng-Feng Huang (Hsinchu, TW); Yi-Kan Cheng (Hsinchu, TW); Lee-Chung Lu (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H10D84/856H01L23/5286H10D30/031H10D30/6713H10D30/6729H10D30/6735H10D30/6757H10D62/118H10D84/0167H10D84/017H10D84/0186H10D84/0188H10D84/038
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Quick Facts
Patent No.
US 12,588,278
App. No.
17/838,090
Granted
Mar 24, 2026
Kind
B2
Abstract

A semiconductor device includes a first cell in a first row, wherein the first row extends in a first direction, the first cell having a first cell height measured in a second direction perpendicular to the first direction. The semiconductor device further includes a second cell in the first row, wherein the second cell has a second cell height measured in the second direction, the second cell height is less than the first cell height. The second cell includes a first active region having a first width measured in the second direction, and a second active region having a second width measured in the second direction, wherein the second width is different from the first width.

Claims (35)

1 . A semiconductor device, comprising:

a first cell in a first row, wherein the first row extends in a first direction, the first cell having a first cell height measured in a second direction perpendicular to the first direction; and

a second cell in the first row, wherein the second cell has a second cell height measured in the second direction, the second cell height is less than the first cell height, and the second cell comprises:

a first active region having a first width measured in the second direction, and

a second active region having a second width measured in the second direction, wherein the second width is different from the first width.

2 . The semiconductor device of claim 1 , wherein the first cell directly abuts the second cell.

3 . The semiconductor device of claim 1 , wherein the first cell comprises a third active region having the first width.

4 . The semiconductor device of claim 3 , wherein the third active region is aligned with the first active region.

5 . The semiconductor device of claim 3 , wherein an edge of the third active region is aligned with an edge of the second active region.

6 . The semiconductor device of claim 1 , wherein the second active region is farther from the first cell than the first active region.

7 . The semiconductor device of claim 1 , wherein the first cell height is twice the second cell height.

8 . The semiconductor device of claim 1 , further comprising a source/drain (S/D) region electrically connected to the first active region.

9 . The semiconductor device of claim 8 , further comprising a bottom isolation structure between the S/D region and a substrate.

10 . The semiconductor device of claim 8 , further comprising a well in a substrate below the S/D region.

11 . The semiconductor device of claim 1 , further comprising a front side power delivery network (PDN).

12 . The semiconductor device of claim 1 , further comprising a backside PDN.

13 . The semiconductor device of claim 12 , further comprising a via extending through a substrate, wherein the via electrically connects the backside PDN to the first active region.

14 . The semiconductor device of claim 12 , further comprising a contact structure extending through a substrate, wherein the contact structure is electrically connected to the backside PDN, and the contact structure is aligned with a boundary of the first cell.

15 . The semiconductor device of claim 14 , wherein the first cell comprises a third active region, the third active region comprises an S/D region, and the contact structure is electrically connected to the S/D region.

16 . A semiconductor device, comprising:

a first cell in a first row, wherein the first row extends in a first direction, the first cell having a first cell height measured in a second direction perpendicular to the first direction, and the first cell comprises a first active region having a first width in the second direction;

a second cell in the first row, wherein the second cell has a second cell height measured in the second direction, the second cell height is less than the first cell height, and the second cell comprises:

a second active region having the first width, and

a third active region having a second width measured in the second direction,

wherein the second width is different from the first width; and

a third cell in a second row, wherein the third cell comprises a fourth active region having the second width, and the third cell directly abuts the first cell.

17 . The semiconductor device of claim 16 , wherein the first active region comprises a plurality of nano-sheets.

18 . The semiconductor device of claim 16 , further comprising a contact structure extending through a substrate at an interface of the first cell and the third cell.

19 . The semiconductor device of claim 16 , further comprising a substrate, wherein a dopant concentration of the substrate is uniform across an entirety of the substrate.

20 . A semiconductor device, comprising:

a first cell in a first row, wherein the first row extends in a first direction, the first cell having a first cell height measured in a second direction perpendicular to the first direction;

a second cell in the first row, wherein the second cell has a second cell height measured in the second direction, the second cell height is less than the first cell height, and the second cell comprises:

a first active region, in a substrate, having a first width measured in the second direction, and

a second active region, in the substrate, having a second width measured in the second direction, wherein the second width is different from the first width; and

a conductive contact structure extending through the substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 12, 2022
From: TZENG, JIANN-TYNG; FANG, SHANG-WEI; LIN, CHUN-YEN; HUANG, SHENG-FENG; CHENG, YI-KAN; LU, LEE-CHUNG; SIO, KAM-TOU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 061063/0230 →
Continuity (2)
Provisional Application 63268546 · Feb 25, 2022
Related Publication 20230275090A1 · Aug 31, 2023
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