Semiconductor and circuit structures, and related methods

1. A circuit structure, comprising:

a first die area comprising an output logic gate;

a second die area comprising a circuit and an input logic gate; and

a die-to-die interconnect;

wherein the input logic gate comprises a transistor, wherein the circuit is connected between the die-to-die interconnect and a gate region of the transistor;

wherein the circuit comprises a PMOS transistor and an NMOS transistor,

wherein a first source/drain region of the PMOS transistor is connected to a first source/drain region of the NMOS transistor and the die-to-die interconnect.

2. The circuit structure of claim 1 , wherein a second source/drain region of the PMOS transistor is connected to a second source/drain region of the NMOS transistor and the gate region of the transistor.

3. The circuit structure of claim 1 , wherein the PMOS transistor is a first PMOS transistor and the NMOS transistor is a first NMOS transistor,

wherein the circuit comprises a second PMOS transistor and a second NMOS transistor,

wherein a first source/drain region of the second PMOS transistor is connected to a first source/drain region of the second NMOS transistor and the gate region of the transistor.

4. The circuit structure of claim 3 , wherein a second source/drain region of the first PMOS transistor is connected to a second source/drain region of the first NMOS transistor,

wherein a second source/drain region of the second PMOS transistor is connected to a second source/drain region of the second NMOS transistor,

wherein the second source/drain region of the first PMOS transistor is connected to the second source/drain region of the second PMOS transistor.

5. The circuit structure of claim 3 , wherein a second source/drain region of the first PMOS transistor is connected to a second source/drain region of the second PMOS transistor,

a second source/drain region of the first NMOS transistor is connected to a second source/drain region of the second NMOS transistor.

6. The circuit structure of claim 1 , wherein the die-to-die interconnect is electrically connected to the gate region of the transistor only via the circuit.

7. The circuit structure of claim 1 , wherein the first die area comprises a first standard cell that comprises the output logic gate.

8. The circuit structure of claim 7 , wherein the second die area comprises a second standard cell that comprises the input logic gate.

9. The circuit structure of claim 8 , wherein the second standard cell comprises the circuit.

10. The circuit structure of claim 1 , wherein the first die and the second die are in a same package.

11. The circuit structure of claim 10 , wherein the package is a chip-on-wafer-on-substrate (CoWoS) package or an integrated fan-out (InFO) package.

12. A method, comprising:

providing a first die comprising an output logic gate;

providing a second die comprising a composite circuit that comprises a passing circuit and an input logic gate, wherein the input logic gate comprises a transistor, wherein the passing circuit comprises a PMOS transistor and an NMOS transistor and is connected to a gate region of the transistor; and

connecting, at least partially via a die-to-die interconnect, the first die and the second die such that the output logic gate of the first die is connected to the passing circuit of the composite circuit of the second die,

wherein a first source/drain region of the PMOS transistor is connected to a first source/drain region of the NMOS transistor and the die-to-die interconnect.

13. The method of claim 12 , wherein providing the second die comprises:

forming a front-end-of-line (FEOL) portion that comprises the composite circuit.

14. The method of claim 12 , wherein providing the second die comprises:

forming a back-end-of-line (BEOL) portion that comprises a conductive interconnect, wherein the conductive interconnect is configured to be electrically connected between the composite circuit and the die-to-die interconnects.

15. The method of claim 12 , wherein providing the second die comprises:

forming a through-silicon via in the second die.

16. The method of claim 12 , wherein connecting the first die and the second die comprises:

encapsulating at least partially the first die and the second die.

17. A semiconductor structure, comprising:

a first die;

a second die comprising a first transistor;

a die-to-die interconnect electrically coupling the first die and the second die; and

a semi-conductive path between the die-to-die interconnect and a gate region of the first transistor,

wherein an effective p-n junction is electrically connected between the semi-conductive path and a reference voltage,

wherein the semi-conductive path is configured to be electrically conductive in response to a presence of a control voltage being greater than a threshold voltage, and is configured to be electrically non-conductive in response to an absence of the control voltage being greater than the threshold voltage.

18. The semiconductor structure of claim 17 , wherein the second die comprises:

a second transistor comprising a gate region, a first source/drain region and a second source/drain region, wherein the second transistor is connected between the die-to-die interconnect and the gate terminal of the first transistor.

19. The semiconductor structure of claim 18 , wherein the first source/drain region of the second transistor is connected to the die-to-die interconnect.

20. The semiconductor structure of claim 19 , wherein the first source/drain region of the second transistor is conductively connected to the die-to-die interconnect.