Composite interposer structure and method of providing same

1. An interposer comprising:

a substrate comprising a glass;

a first insulator structure and first interconnects therein; and

a second insulator structure and second interconnects therein, wherein respective inorganic dielectrics of the first insulator structure and the second insulator structure adjoin each other at a material interface, which extends to each of the substrate and a first side of the interposer;

wherein first contacts, to couple the interposer to a first IC chip, are in an arrangement which spans the material interface at the first side;

wherein second contacts, to couple the interposer to a second IC chip, are at a first surface of the first insulator structure, and are coupled to respective ones of the first contacts via the first interconnects; and

wherein third contacts, at a second side of the interposer opposite the first side, are coupled to respective ones of the first contacts via the second interconnects.

2. The interposer of claim 1 , wherein the first contacts comprise:

fourth contacts at the first surface; and

fifth contacts at a second surface of the second insulator structure;

wherein a first metallization feature pitch of the fourth contacts is smaller than a corresponding second metallization feature pitch of the fifth contacts.

3. The interposer of claim 2 , wherein sixth contacts, to further couple the interposer to the second IC chip, are at the second surface; and

wherein the third contacts comprise seventh contacts and eighth contacts, wherein the second interconnects are electrically coupled each between a respective one of the fifth contacts and a respective one of the seventh contacts, and wherein the interposer further comprises third interconnects in the second insulator structure, the third interconnects are electrically coupled each between a respective one of the sixth contacts and a respective one of the eighth contacts.

4. The interposer of claim 1 , wherein the material interface comprises an artifact of one of a cut process, an etch process, a grind process, or a polish process.

5. The interposer of claim 1 , wherein, at the first side, the first insulator structure comprises an artifact of one of a cut process, an etch process, a grind process, or a polish process.

6. The interposer of claim 1 , wherein the first interconnects comprise a first metallization layer, wherein the second interconnects comprise a second metallization layer which, of any metallization layers of the second interconnects, is most aligned vertically with the first metallization layer, wherein a side of the first metallization layer is offset vertically from a corresponding side of the second metallization layer.

7. The interposer of claim 1 , wherein a first dielectric material of the first insulator structure and a second dielectric material of the second insulator structure, the first dielectric material other than the second dielectric material, each extend to the material interface.

8. The interposer of claim 7 , wherein the first dielectric material comprises a low-k dielectric.

9. The interposer of claim 1 , further comprising active circuit components between the substrate and the first insulator structure, the active circuit components coupled, via the first interconnects, between the first contacts and the second contacts.

10. The interposer of claim 1 , further comprising a semiconductor substrate between the first insulator structure and the substrate, wherein one of the first interconnects further extends through the semiconductor substrate.

11. A system comprising:

an interposer comprising:

a substrate comprising a glass;

a first insulator structure and first interconnects therein; and

a second insulator structure and second interconnects therein, wherein respective inorganic dielectrics of the first insulator structure and the second insulator structure adjoin each other at a material interface, which extends to each of the substrate and a first side of the interposer;

a first IC chip coupled to the interposer via first contacts which are in an arrangement which spans the material interface at the first side;

a second IC chip coupled to the interposer via second contacts, at a first surface of the first insulator structure, which are coupled to respective ones of the first contacts via the first interconnects; and

a circuit board coupled to the interposer via third contacts, at a second side of the interposer opposite the first side, which are coupled to respective ones of the first contacts via the second interconnects.

12. The system of claim 11 , wherein the first contacts comprise:

fourth contacts at the first surface; and

fifth contacts at a second surface of the second insulator structure;

wherein a first metallization feature pitch of the fourth contacts is smaller than a corresponding second metallization feature pitch of the fifth contacts.

13. The system of claim 11 , wherein the first interconnects comprise a first metallization layer, wherein the second interconnects comprise a second metallization layer which, of any metallization layers of the second interconnects, is most aligned vertically with the first metallization layer, wherein a side of the first metallization layer is offset vertically from a corresponding side of the second metallization layer.

14. The system of claim 11 , wherein a first dielectric material of the first insulator structure and a second dielectric material of the second insulator structure, the first dielectric material other than the second dielectric material, each extend to the material interface.

15. The system of claim 11 , further comprising active circuit components between the substrate and the first insulator structure, the active circuit components coupled, via the first interconnects, between the first contacts and the second contacts.