Electronic device
An electronic device including a light emitting element, a wavelength conversion layer, a conductive wire and a wavelength selection layer is provided by the present disclosure. The light emitting element is configured to emit a light. The wavelength conversion layer is configured to convert the light. The conductive wire is electrically connected to the light emitting element. The wavelength selection layer is disposed between the conductive wire and the wavelength conversion layer, wherein the conductive wire is cured by an energy beam, and the wavelength selection layer is configured to block the energy beam.
1. An electronic device, comprising:
a first substrate having a first surface, a second surface and a first side surface, wherein the second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface;
a light emitting element disposed on the first surface and configured to emit a light;
a wavelength conversion layer disposed on the light emitting element and configured to convert the light;
a conductive wire electrically connected to the light emitting element; and
an adhesive layer disposed on the first surface and the light emitting element, wherein the adhesive layer has a second side surface, a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.
2. The electronic device of claim 1 , wherein a second portion of the conductive wire is disposed on the second surface.
3. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer is disposed between the conductive wire and the first substrate.
4. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer is disposed between the light emitting element and the first substrate.
5. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer is disposed on the light emitting element.
6. The electronic device of claim 1 , further comprising a wavelength selection layer and a second substrate, wherein the wavelength selection layer is disposed between the conductive wire and the wavelength conversion layer, the second substrate is disposed opposite to the first substrate, and the wavelength conversion layer and the wavelength selection layer are disposed on the second substrate.
7. The electronic device of claim 2 , wherein the conductive wire is disposed on the second surface and the first side surface of the first substrate through a printing process.
8. The electronic device of claim 1 , further comprising a second substrate, wherein the adhesive layer is disposed between the first substrate and the second substrate.
9. The electronic device of claim 1 , wherein the adhesive layer comprises optical clear resin.
10. The electronic device of claim 1 , wherein the light emitting element is covered by the adhesive layer.
11. The electronic device of claim 1 , further comprising a circuit layer disposed on the first surface of the first substrate, wherein the circuit layer is electrically connected to a bonding pad of the light emitting element.
12. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer comprises multiple layers having at least two different refractive indices.
13. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer comprises a material selected from a group consisting of silver, gold, copper, aluminum, chromium, platinum, and a combination thereof.
14. The electronic device of claim 1 , further comprising an encapsulation layer disposed on the light emitting element, wherein the wavelength conversion layer is disposed between the encapsulation layer and the light emitting element.
15. The electronic device of claim 1 , wherein the wavelength conversion layer comprises quantum dot material, phosphor material or fluorescence material.
16. The electronic device of claim 1 , wherein the conductive wire comprises conductive glue.
17. The electronic device of claim 1 , further comprising a wavelength selection layer disposed between the conductive wire and the wavelength conversion layer, wherein the wavelength selection layer comprises an infrared light absorber.
18. The electronic device of claim 1 , further comprising a color filter disposed on the wavelength conversion layer.