IP Library Granted Patent US 11,671,521
Granted Patent B2
US 11,671,521 · App. 16/684,428 · Granted Jun 6, 2023

Ethernet interface and related systems, methods and devices

Inventors: Venkatraman Iyer (Austin, TX); Dixon Chen (Shenzhen, CN); John Junling Zang (Shenzhen, CN); Shivanand I. Akkihal (Austin, TX)
Assignee: Microchip Technology Incorporated
H04L69/323H04L7/0016H04L47/22H04L69/329
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Quick Facts
Patent No.
US 11,671,521
App. No.
16/684,428
Granted
Jun 6, 2023
Kind
B2
Abstract

Disclosed embodiments relate, generally, to improved data reception handling at a physical layer (PHY). Some embodiments relate to end of line systems that include legacy media access control (MAC) and PHY that implement improved data reception handling disclosed herein. The improved data reception handling improves the operation of the end of line systems, and the MAC more specifically, and in some cases to comply with media access tuning protocols implemented at the physical layer.

Claims (40)

1. A system, comprising:

a physical layer side receive datapath circuitry to move receive data toward a link layer side receive datapath circuitry, the physical layer side receive datapath circuitry comprising:

a first portion coupled to operate according to a first clock domain;

a second portion coupled to operate according to a second clock domain; and

a transition boundary where receive data moved via the physical layer side receive datapath circuitry crosses from the second clock domain to the first clock domain; and

a physical layer side transmit datapath circuitry to move transmit data toward a shared transmission medium,

wherein the physical layer side transmit datapath circuitry coupled to move transmit data toward the shared transmission medium according to the first clock domain.

2. The system of claim 1 , further comprising a control datapath.

3. The system of claim 2 , wherein the control datapath to move control data to or from a physical layer of the system.

4. The system of claim 3 , wherein the control datapath to move the control data between the physical layer of the system and an application layer of a network protocol stack.

5. The system of claim 3 , wherein the control datapath to move the control data between the physical layer of the system and a device that is separate from a network protocol stack.

6. The system of claim 3 , wherein the control datapath may be used for one or more control cycles that comprise moving control data to or from the physical layer.

7. The system of claim 6 , wherein one of the one or more control cycles is associated with one of a time aware protocol, a traffic shaping protocol, and a physical layer collision avoidance protocol.

8. A circuitry of a physical layer device, comprising:

a local clock generator to generate a local clock;

a transmit circuitry and a first portion of a receive circuitry, wherein each of the transmit circuitry and the first portion of the receive circuitry are operatively coupled to an output of the local clock generator and are clocked by the local clock, wherein the transmit circuitry to move transmit data toward a shared transmission medium based on the local clock;

a second portion of a receive circuitry coupled to operate according to a remote clock; and

one or more outputs, wherein the one or more outputs comprise a first output operatively coupled to the clock generator to propagate the local clock.

9. The circuitry of claim 8 , further comprising an interconnect, the interconnect to operably couple the first output to a receive clock input of a link layer device and to a transmit clock input of the link layer device.

10. The circuitry of claim 8 , wherein the one or more outputs comprise a second output, the second output assigned to a signal for exclusive collision signaling.

11. The circuitry of claim 8 , further comprising one or more inputs, wherein the one or more inputs comprise a first input operatively coupled to the transmit circuitry, wherein the first input is assigned to a signal for control signaling.

12. The circuitry of claim 11 , further comprising an interconnect, the interconnect to operably couple the first input to one or more devices above a link layer of a network protocol stack.

13. The circuitry of claim 12 , further comprising interface circuitry for operable coupling to the shared transmission medium.

14. The circuitry of claim 13 , wherein one of the one or more devices is a time syncing circuit.

15. The circuitry of claim 8 , wherein at least one output of the one or more outputs for exclusive collision signaling.

16. The circuitry of claim 15 , further comprising an interconnect, the interconnect is to operatively couple the at least one output for exclusive collision signaling to an input of a link layer device for exclusive collision signaling.

17. The circuitry of claim 8 , further comprising a reference clock generator to generate a local reference clock.

18. The circuitry of claim 17 , wherein the local clock generator to generate the local clock responsive to the local reference clock.

19. The circuitry of claim 17 , wherein the receive circuitry comprises:

an oversampling circuit to receive the local reference clock; and

a synchronization circuit to receive the local clock.

20. A method, comprising:

starting a data reception from a shared transmission medium; and

moving receive data toward an interface for operative coupling to a link layer, wherein the moving the receive data comprises crossing the receive data from a remote clock domain to a local clock domain of a physical layer device, the link layer coupled to operate on the local clock domain of the physical layer device.

21. The method of claim 20 , wherein the moving the receive data further comprises:

oversampling data received from the shared transmission medium.

22. The method of claim 21 , wherein the moving the receive data further comprises:

performing digital clock and data recovery using the oversampled data.

23. The method of claim 22 , further comprising:

providing the receive data to the interface for sending to the link layer.

Assignments (13)
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 060894/0437 →
RELEASE OF SECURITY INTEREST Recorded Mar 11, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059363/0001 →
RELEASE OF SECURITY INTEREST Recorded Mar 10, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059863/0400 →
RELEASE OF SECURITY INTEREST Recorded Mar 9, 2022
From: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059358/0335 →
RELEASE OF SECURITY INTEREST Recorded Feb 28, 2022
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 059263/0001 →
GRANT OF SECURITY INTEREST IN PATENT RIGHTS Recorded Nov 19, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 058214/0625 →
SECURITY INTEREST Recorded Jun 4, 2021
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT
Reel/Frame 057935/0474 →
SECURITY INTEREST Recorded Dec 24, 2020
From: MICROCHIP TECHNOLOGY INCORPORATED; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 055671/0612 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: WELLS FARGO BANK, NATIONAL ASSOCIATION
Reel/Frame 053468/0705 →
SECURITY INTEREST Recorded Jun 5, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 052856/0909 →
RELEASE OF SECURITY INTEREST Recorded May 30, 2020
From: JPMORGAN CHASE BANK, N.A, AS ADMINISTRATIVE AGENT
To: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
Reel/Frame 053466/0011 →
SECURITY INTEREST Recorded Apr 24, 2020
From: MICROCHIP TECHNOLOGY INC.; SILICON STORAGE TECHNOLOGY, INC.; ATMEL CORPORATION; MICROSEMI CORPORATION; MICROSEMI STORAGE SOLUTIONS, INC.
To: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 053311/0305 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 10, 2019
From: IYER, VENKAT; CHEN, DIXON; ZANG, JOHN JUNLING; AKKIHAL, SHIVANAND I.
To: MICROCHIP TECHNOLOGY INCORPORATED
Reel/Frame 051227/0311 →