Semiconductor device and method of manufacturing the same
In one embodiment, a semiconductor device includes a substrate, and a plurality of insulating layers provided on the substrate. The device further includes a plurality of electrode layers provided on the substrate alternately with the plurality of insulating layers and including metal atoms and impurity atoms different from the metal atoms, lattice spacing between the metal atoms in the electrode layers being greater than lattice spacing between the metal atoms in an elemental substance of the metal atoms.
1. A semiconductor device comprising:
a substrate;
an insulator provided on the substrate; and
a plug provided in the insulator and including metal atoms and impurity atoms different from the metal atoms, lattice spacing between the metal atoms in the plug being greater than lattice spacing between the metal atoms in an elemental substance of the metal atoms,
wherein a portion having a highest concentration of the impurity atoms in the plug is located at an upper surface of the plug.
2. The device of claim 1 , wherein the metal atoms include tungsten atoms, and the impurity atoms include silicon atoms, boron atoms or nitrogen atoms.
3. The device of claim 1 , wherein a concentration of the impurity atoms in the plug varies from minimum of 1.0×10 20 atoms/cm 3 to maximum of 5.0×10 22 atoms/cm 3 .
4. The device of claim 1 , wherein the plug includes the impurity atoms such that the plug has a concentration gradient of the impurity atoms.
5. The device of claim 1 , wherein a concentration of the impurity atoms in the plug decreases as a distance from an upper surface of the plug increases.