Photoresist composition and method of forming photoresist pattern
Method of forming pattern in photoresist layer includes forming photoresist layer over substrate, selectively exposing photoresist layer to actinic radiation forming latent pattern. Latent pattern is developed by applying developer to form pattern. Photoresist layer includes photoresist composition including polymer: A 1 , A 2 , L are direct bond, C4-C30 aromatic, C4-C30 alkyl, C4-C30 cycloalkyl, C4-C30 hydroxylalkyl, C4-C30 alkoxy, C4-C30 alkoxyl alkyl, C4-C30 acetyl, C4-C30 acetylalkyl, C4-C30 alkyl carboxyl, C4-C30 cycloalkyl carboxyl, C4-C30 hydrocarbon ring, C4-C30 heterocyclic, —COO—, A1 and A2 are not both direct bonds, and are unsubstituted or substituted with a halogen, carbonyl, or hydroxyl; A 3 is C6-C14 aromatic, wherein A 3 is unsubstituted or substituted with halogen, carbonyl, or hydroxyl; R 1 is acid labile group; Ra, Rb are H or C1-C3 alkyl; R f is direct bond or C1-C5 fluorocarbon; PAG is photoacid generator; 0≤x/(x+y+z)≤1, 0≤y/(x+y+z)≤1, and 0≤z/(x+y+z)≤1.
1. A method of forming a pattern in a photoresist layer, comprising:
forming a photoresist layer over a substrate;
selectively exposing the photoresist layer to actinic radiation to form a latent pattern; and
developing the latent pattern by applying a developer to the selectively exposed photoresist layer to form a pattern,
wherein the photoresist layer includes a photoresist composition comprising a polymer,
wherein the polymer has a formula:
where A 1 , A 2 , and L are independently a direct bond, a C4-C30 aromatic group, a C4-C30 alkyl group, a C4-C30 cycloalkyl group, a C4-C30 hydroxylalkyl group, a C4-C30 alkoxy group, a C4-C30 alkoxyl alkyl group, a C4-C30 acetyl group, a C4-C30 acetylalkyl group, a C4-C30 alkyl carboxyl group, a C4-C30 cycloalkyl carboxyl group, a C4-C30 saturated or unsaturated hydrocarbon ring, or a C4-C30 heterocyclic group, wherein A 1 and A 2 are not both direct bonds, wherein A 1 and A 2 are unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
A 3 is a C6-C14 aromatic group, wherein A 3 is unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
R 1 is an acid labile group;
Ra and Rb are independently H or a C1-C3 alkyl group;
R f is a direct bond or a C1-C5 fluorocarbon;
PAG is a photoacid generator; and
0<x/(x+y+z)<1, 0<y/(x+y+z)<1, and 0<z/(x+y+z)<1.
2. The method according to claim 1 , wherein A 1 , A 2 , and A 3 are independently a chain, ring, or three-dimensional structure.
3. The method according to claim 2 , wherein at least one of A 1 , A 2 , and A 3 is a three-dimensional adamantyl or norbornyl structure.
4. The method according to claim 1 , wherein R 1 is a C4-C15 alkyl group, a C4-C15 cycloalkyl group, a C4-C15 hydroxylalkyl group, a C4-C15 alkoxy group, or a C4-C15 alkoxyl alkyl group.
5. The method according to claim 1 , wherein the photoacid generator includes a triphenylsulfonium group and a sulfonate group.
6. The method according to claim 1 , wherein R f is a perfluorinated group.
7. The method according to claim 1 , wherein A 3 is a phenol group, a hydroxynaphthalene group, or a hydroxyanthracene group.
8. The method according to claim 1 , wherein A 1 , A 2 , and A 3 are independently a phenyl group or a naphthalenyl group.
9. The method according to claim 1 , wherein L is a direct bond and A 3 is a p-phenol group, and 0.2≤x/(x+y+z)≤0.5.
10. The method according to claim 1 , wherein A 1 is not a direct bond and 0.2≤y/(x+y+z)≤0.7.
11. A method of manufacturing a semiconductor device,
forming a photoresist layer over a substrate, comprising:
wherein the photoresist layer comprises a photoresist composition, comprising a polymer having a formula:
where A 1 , A 2 , and L are independently a direct bond, a C4-C30 aromatic group, a C4-C30 alkyl group, a C4-C30 cycloalkyl group, a C4-C30 hydroxylalkyl group, a C4-C30 alkoxy group, a C4-C30 alkoxyl alkyl group, a C4-C30 acetyl group, a C4-C30 acetylalkyl group, a C4-C30 alkyl carboxyl group, a C4-C30 cycloalkyl carboxyl group, a C4-C30 saturated or unsaturated hydrocarbon ring, or a C4-C30 heterocyclic group, wherein A 1 and A 2 are not both direct bonds, wherein A 1 and A 2 are unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
A 3 is a C6-C14 aromatic group, wherein A 3 is unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
R 1 is an acid labile group;
Ra and Rb are independently H or a C1-C3 alkyl group;
R f is a direct bond or a C1-C5 fluorocarbon;
PAG is a photoacid generator; and
0<x/(x+y+z)<1, 0<y/(x+y+z)<1, and 0<z/(x+y+z)<1;
forming a latent pattern in the photoresist layer by patternwise exposing the photoresist layer to actinic radiation;
applying a developer to the patternwise exposed photoresist layer to form a pattern exposing a portion of the substrate; and
extending the pattern into substrate.
12. The method according to claim 11 , wherein the extending the pattern into the substrate comprises etching the substrate.
13. The method according to claim 11 , further comprising heating the photoresist layer at a temperature of 50° C. to 160° C. after the forming a latent pattern and before the applying a developer.
14. The method according to claim 11 , further comprising heating the photoresist layer at a temperature of 40° C. to 120° C. before the forming a latent pattern.
15. The method according to claim 11 , wherein the actinic radiation is extreme ultraviolet radiation.
16. A photoresist composition, comprising:
a polymer,
wherein the polymer has a formula:
where A 1 , A 2 , and L are independently a direct bond, a C4-C30 aromatic group, a C4-C30 alkyl group, a C4-C30 cycloalkyl group, a C4-C30 hydroxylalkyl group, a C4-C30 alkoxy group, a C4-C30 alkoxyl alkyl group, a C4-C30 acetyl group, a C4-C30 acetylalkyl group, a C4-C30 alkyl carboxyl group, a C4-C30 cycloalkyl carboxyl group, a C4-C30 saturated or unsaturated hydrocarbon ring, or a C4-C30 heterocyclic group, wherein A 1 and A 2 are not both direct bonds, wherein A 1 and A 2 are unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
A 3 is a C6-C14 aromatic group, wherein A 3 is unsubstituted or substituted with a halogen, carbonyl group, or hydroxyl group;
R 1 is an acid labile group;
Ra and Rb are independently H or a C1-C3 alkyl group;
R f is a direct bond or a C1-C5 fluorocarbon;
PAG is a photoacid generator; and
0<x/(x+y+z)<1, 0<y/(x+y+z)<1, and 0<z/(x+y+z)<1.
17. The photoresist composition of claim 16 , wherein A 1 , A 2 , and A 3 are independently a chain, ring, or three-dimensional structure.
18. The photoresist composition of claim 17 , wherein at least one of A 1 , A 2 , and A 3 is a three-dimensional structure selected from an adamantyl or a norbornyl structure.
19. The photoresist composition of claim 16 , wherein R 1 is a C4-C15 alkyl group, a C4-C15 cycloalkyl group, a C4-C15 hydroxylalkyl group, a C4-C15 alkoxy group, or a C4-C15 alkoxyl alkyl group.
20. The photoresist composition of claim 16 , wherein the photoacid generator includes a triphenylsulfonium group and a sulfonate group.