IP Library › Granted Patent US 11,719,579
Granted Patent B2
US 11,719,579 · App. 17/578,691 · Granted Aug 8, 2023

Wearable infrared temperature sensing device

Inventors: Chih-Ming Sun (Hsin-Chu, TW); Ming-Han Tsai (Hsin-Chu, TW); Cheng-Nan Tsai (Hsin-Chu, TW)
Assignee: PIXART IMAGING INC.
G01J5/0265B81B7/0064B81B7/0067G01J5/041G01J5/045G01J5/06H04N5/33H04N23/57B81B2201/0278
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Quick Facts
Patent No.
US 11,719,579
App. No.
17/578,691
Granted
Aug 8, 2023
Kind
B2
Abstract

A wearable device includes a case and a far infrared temperature sensing device. The case has a first opening. The far infrared temperature sensing device is disposed inside the case of the wearable device. The far infrared temperature sensing device includes an assembly structure, a sensor chip, a filter structure, and a metal shielding structure. The assembly structure has an accommodating space and a top opening. The sensor chip is disposed in the accommodating space of the assembly structure. The filter structure is disposed above the sensor chip. The metal shielding structure is disposed above the sensor chip, and has a second opening to expose the filter structure. The first and second openings are communicated to cooperatively define a through hole.

Claims (17)

1. A wearable device, comprising:

a case having a first opening; and

a far infrared temperature sensing device disposed inside the case of the wearable device, and the far infrared temperature sensing device including:

a first substrate;

a sensor chip which is disposed on the first substrate; and

a metal shielding structure which is disposed on the first substrate and surrounds the sensor chip, wherein the metal shielding structure has a second opening.

2. The wearable device as claimed in claim 1 , wherein the far infrared temperature sensing device further comprises:

a second substrate disposed in the case; and

a waterproof structure disposed in the first opening of the case;

wherein the waterproof structure is used to enclose the case.

3. The wearable device as claimed in claim 1 , wherein the sensor chip is electrically connected to the first substrate by at least one wire.

4. The wearable device as claimed in claim 2 , wherein the waterproof structure is an infrared passing structure.

5. The wearable device as claimed in claim 2 , wherein the first substrate is disposed on the second substrate.

6. The wearable device as claimed in claim 1 , wherein the sensor chip is configured to detect a far infrared which has a wavelength ranging from 15 to 1000 μm.

7. The wearable device as claimed in claim 1 , wherein the metal shielding structure is configured to block the noise generated from other sensors and external electronic products, and prevent other far infrared from passing into the case.

8. The wearable device as claimed in claim 1 , wherein the case is a watch case of a smartwatch, the first substrate is a SMD substrate or a CLCC substrate, and the sensor chip is a far infrared sensor chip.

9. The wearable device as claimed in claim 2 , wherein the second substrate is a PCB and the waterproof structure is a waterproof glue or a waterproof layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 19, 2022
From: SUN, CHIH-MING; TSAI, MING-HAN; TSAI, CHENG-NAN
To: PIXART IMAGING INC.
Reel/Frame 058691/0084 →
Priority Claims (2)
TW 104108897 · Mar 20, 2015 · national
TW 105108127 · Mar 16, 2016 · national
Continuity (5)
Continuation 16850187 · Apr 16, 2020
Continuation 16194212 · Nov 16, 2018
Continuation 15172983 · Jun 3, 2016
Continuation In Part 14726472 · May 30, 2015
Related Publication 20220136905A1 · May 5, 2022