IP Library › Granted Patent US 11,722,222
Granted Patent B2
US 11,722,222 · App. 17/507,143 · Granted Aug 8, 2023

Transceiver device

Inventors: Hideaki Fukuzawa (Tokyo, JP); Tomohito Mizuno (Tokyo, JP); Tetsuya Shibata (Tokyo, JP); Takashi Kikukawa (Tokyo, JP)
Assignee: TDK CORPORATION
H04B10/503H04B10/40H04B10/532
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Quick Facts
Patent No.
US 11,722,222
App. No.
17/507,143
Granted
Aug 8, 2023
Kind
B2
Abstract

A transceiver device includes: a receiving device including a magnetic element having a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, wherein the receiving device is configured to receive an optical signal; a transmission device including a modulated light output element, wherein the transmission device is configured to transmit an optical signal; and a circuit chip including an integrated circuit electrically connected to the magnetic element and the modulated light output element.

Claims (60)

1. A transceiver device comprising:

a receiving device including a magnetic element having a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, the receiving device being configured to receive an optical signal;

a transmission device including a modulated light output element, the transmission device being configured to transmit an optical signal; and

a circuit chip including an integrated circuit electrically connected to the magnetic element and the modulated light output element,

wherein the magnetic element and the modulated light output element are arranged in a direction perpendicular to a surface of the circuit chip, and

a position of the circuit chip in the direction is between a position of the magnetic element in the direction and a position of the modulated light output element in the direction.

2. The transceiver device according to claim 1 ,

wherein the magnetic element and the integrated circuit are electrically connected via first through wiring that passes through an insulating layer between the magnetic element and the integrated circuit, and

the modulated light output element and the integrated circuit are electrically connected via second through wiring that passes through an insulating layer between the modulated light output element and the integrated circuit.

3. The transceiver device according to claim 1 ,

wherein the modulated light output element and the integrated circuit are electrically connected via a bump between the transmission device and the circuit chip.

4. The transceiver device according to claim 1 , wherein the modulated light output element is an optical modulation element.

5. The transceiver device according to claim 4 ,

wherein the optical modulation element includes a waveguide, and

the waveguide includes lithium niobate.

6. The transceiver device according to claim 1 , further comprising:

an input portion configured to apply light including a signal to the magnetic element;

an output portion configured to output light including a signal generated by the modulated light output element;

a first fiber configured to connect the input portion to an external portion; and

a second fiber configured to connect the output portion to an external portion.

7. A transceiver device comprising:

a receiving device including a magnetic element having a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, the receiving device being configured to receive an optical signal;

a transmission device including a modulated light output element, the transmission device being configured to transmit an optical signal; and

a circuit chip including an integrated circuit electrically connected to the magnetic element and the modulated light output element,

wherein the magnetic element and the modulated light output element are arranged in a direction perpendicular to a surface of the circuit chip, and

a position of the magnetic element in the direction is between a position of the modulated light output element in the direction and a position of the circuit chip in the direction.

8. The transceiver device according to claim 7 ,

wherein the magnetic element and the integrated circuit are electrically connected via first through wiring that passes through an insulating layer between the magnetic element and the integrated circuit, and

the modulated light output element and the integrated circuit are electrically connected via second through wiring that passes through an insulating layer between the modulated light output element and the integrated circuit.

9. The transceiver device according to claim 7 ,

wherein the modulated light output element and the integrated circuit are electrically connected via a bump between the transmission device and the circuit chip.

10. The transceiver device according to claim 7 , wherein the modulated light output element is an optical modulation element.

11. The transceiver device according to claim 10 ,

wherein the optical modulation element includes a waveguide, and

the waveguide includes lithium niobate.

12. The transceiver device according to claim 7 , further comprising:

an input portion configured to apply light including a signal to the magnetic element;

an output portion configured to output light including a signal generated by the modulated light output element;

a first fiber configured to connect the input portion to an external portion; and

a second fiber configured to connect the output portion to an external portion.

13. A transceiver device comprising:

a receiving device including a magnetic element having a first ferromagnetic layer, a second ferromagnetic layer, and a spacer layer sandwiched between the first ferromagnetic layer and the second ferromagnetic layer, the receiving device being configured to receive an optical signal;

a transmission device including a modulated light output element, the transmission device being configured to transmit an optical signal; and

a circuit chip including an integrated circuit electrically connected to the magnetic element and the modulated light output element,

wherein the magnetic element and the modulated light output element are arranged in a direction perpendicular to a surface of the circuit chip, and

a position of the modulated light output element in the direction is between a position of the magnetic element in the direction and a position of the circuit chip in the direction.

14. The transceiver device according to claim 13 ,

wherein the magnetic element and the integrated circuit are electrically connected via first through wiring that passes through an insulating layer between the magnetic element and the integrated circuit, and

the modulated light output element and the integrated circuit are electrically connected via second through wiring that passes through an insulating layer between the modulated light output element and the integrated circuit.

15. The transceiver device according to claim 13 ,

wherein the modulated light output element and the integrated circuit are electrically connected via a bump between the transmission device and the circuit chip.

16. The transceiver device according to claim 13 , wherein the modulated light output element is an optical modulation element.

17. The transceiver device according to claim 16 ,

wherein the optical modulation element includes a waveguide, and

the waveguide includes lithium niobate.

18. The transceiver device according to claim 13 , further comprising:

an input portion configured to apply light including a signal to the magnetic element;

an output portion configured to output light including a signal generated by the modulated light output element;

a first fiber configured to connect the input portion to an external portion; and

a second fiber configured to connect the output portion to an external portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 21, 2021
From: FUKUZAWA, HIDEAKI; MIZUNO, TOMOHITO; SHIBATA, TETSUYA; KIKUKAWA, TAKASHI
To: TDK CORPORATION
Reel/Frame 057865/0971 →
Priority Claims (4)
JP 2020-178235 · Oct 23, 2020 · national
JP 2021-103981 · Jun 23, 2021 · national
JP 2021-127523 · Aug 3, 2021 · national
JP 2021-128190 · Aug 4, 2021 · national
Continuity (1)
Related Publication 20220131612A1 · Apr 28, 2022
Cited By (4)
US 12,218,161 US 12,298,178 US 12,332,114 US 12,641,914