Optical image stabilization (OIS) unit of a camera module

1. An Optical Image Stabilization (OIS) unit comprising;

a base;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;

a first coil disposed on the bobbin;

a magnet configured to interact with the first coil;

a second coil configured to interact with the magnet;

a wire coupled with the holder module;

a first connection unit fixing a first end portion of the wire; and

a buffer portion disposed on a part of the wire and comprising an adhesive material,

wherein, in a direction perpendicular to the wire, a maximum width of the buffer portion is greater than a maximum width of the first connection unit.

2. The OIS unit of claim 1 , wherein at least a portion of the buffer portion is disposed between the first connection unit and the outer blade.

3. The OIS unit of claim 1 , wherein the spring member comprises an upper spring coupled to an upper portion of the bobbin and a lower spring coupled to a lower portion of the bobbin, and

wherein the first connection unit is disposed nearer to the upper spring than the lower spring.

4. The OIS unit of claim 1 , further comprising a first substrate disposed on the base and comprising a terminal,

wherein the first substrate comprises a first portion disposed on the base and a second portion bent from the first portion, and

wherein the wire connects the holder module and the first portion of the first substrate.

5. The OIS unit of claim 4 , wherein the first portion of the first substrate comprises a first surface facing the holder module and a second surface disposed opposite to the first surface, and

wherein the wire is coupled to the second surface of the first portion of the first substrate.

6. The OIS unit of claim 4 , wherein the first substrate comprises a pad disposed on the first portion and a hole disposed in a center area of the pad, and

wherein the wire passes through the hole and is coupled to the pad by a solder.

7. The OIS unit of claim 6 , wherein a solder resistor is disposed on a periphery of the pad to form an outer surface of the first substrate.

8. The OIS unit of claim 3 , further comprising a second connection unit fixing a second end portion of the wire,

wherein the second connection unit is disposed nearer to the lower spring than the upper spring.

9. The OIS unit of claim 8 , wherein the first connection unit comprises a first solder, and

wherein the second connection unit comprises a second solder.

10. The OIS unit of claim 9 , wherein at least a portion of the buffer portion is disposed between the first solder and the second solder.

11. The OIS unit of claim 1 , wherein the holder module comprises first, second, third and fourth corner portions, and

wherein the wire is disposed on each of the first, second, third and fourth corner portions of the holder module.

12. The OIS unit of claim 11 , wherein the wire comprises six wires spaced apart from each other,

wherein two wires of the six wires are disposed on the first corner portion, and another two wires of the six wires are disposed on the third corner portion, and

wherein the first corner portion and the third corner portion are disposed opposite to each other based on an optical axis.

13. The OIS unit of claim 1 , wherein the first coil is electrically connected with the wire.

14. The OIS unit of claim 12 , wherein the two wires disposed on the first corner portion are electrically connected with the first coil.

15. The OIS unit of claim 1 , wherein the buffer portion is configured to absorb a shock or load applied to the wire.

16. A camera module, comprising:

a printed circuit board (PCB);

an image sensor disposed on the PCB;

the OIS unit of claim 1 disposed on the PCB; and

a lens coupled to the bobbin of the OIS unit and being spaced apart from the image sensor.

17. A mobile phone, comprising the camera module of claim 16 .

18. An Optical Image Stabilization (OIS) unit comprising;

a base;

a holder module comprising an outer blade spaced apart from the base, a bobbin disposed in the outer blade, and a spring member connecting the outer blade and the bobbin;

a first coil disposed on the bobbin;

a magnet configured to interact with the first coil;

a second coil configured to interact with the magnet;

a wire coupled with the holder module;

a first solder fixing a first end portion of the wire; and

a buffer portion disposed on a part of the wire and comprising an adhesive material,

wherein the first solder is disposed within the buffer portion.

19. The OIS unit of claim 18 , wherein, in a direction perpendicular to the wire, a maximum width of the buffer portion is greater than a maximum width of the first solder.