Molded interconnect device
A molded interconnect device that comprises a substrate and conductive elements disposed on the substrate is provided. The substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix. The mineral filler has an average diameter of about 25 micrometers or less. The polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further exhibits a surface resistivity of about 1×1014 ohm or more.
1. A molded interconnect device comprising:
a substrate comprising a polymer composition containing a polymer matrix that includes a thermotropic liquid crystalline polymer and from about 10 parts to about 80 parts by weight of a mineral filler per 100 parts by weight of the polymer matrix, wherein the mineral filler has an average diameter of about 25 micrometers or less, wherein the polymer composition contains copper in an amount of about 1,000 parts per million or less and chromium in an amount of about 2,000 parts per million or less, and further wherein the polymer composition exhibits a surface resistivity of about 1×10 16 ohm or more as determined in accordance with IEC 62631-3-1:2016; and
conductive elements disposed on the substrate.
2. The molded interconnect device of claim 1 , wherein the polymer composition is free of spinel crystals having the formula, AB 2 O 4 , wherein A is a metal cation having a valance of 2 and B is a metal cation having a valance of 3.
3. The molded interconnect device of claim 1 , wherein the polymer composition is free of copper chromite.
4. The molded interconnect device of claim 1 , wherein the polymer composition exhibits a volume resistivity of about 1×10 12 ohm-m or more as determined in accordance with IEC 62631-3-1:2016.
5. The molded interconnect device of claim 1 , wherein the polymer composition exhibits a surface resistivity of about 1×10 17 ohm or more as determined in accordance with IEC 62631-3-1:2016.
6. The molded interconnect device of claim 1 , wherein the polymer composition is free of electrically conductive fillers having an intrinsic volume resistivity of less than about 0.1 ohm-cm.
7. The molded interconnect device of claim 1 , wherein the polymer composition is free of electrically conductive carbon materials.
8. The molded interconnect device of claim 1 , wherein the polymer matrix constitutes from about 30 wt. % to about 80 wt. % of the polymer composition.
9. The molded interconnect device of claim 1 , wherein the liquid crystalline polymer has a melting temperature of about 280° C. or more.
10. The molded interconnect device of claim 1 , wherein the liquid crystalline polymer contains one or more repeating units derived from an aromatic hydroxycarboxylic acid, wherein the hydroxycarboxylic acid repeating units constitute about 40 mol. % or more of the polymer.
11. The molded interconnect device of claim 10 , wherein the liquid crystalline polymer contains repeating units derived from 4-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, or a combination thereof.
12. The molded interconnect device of claim 11 , wherein the liquid crystalline polymer contains repeating units derived from 4-hydroxybenzoic acid in an amount of from about 30 mol. % to about 90 mol. % of the polymer and contains repeating units derived from 6-hydroxy-2-naphthoic acid in amount of from about 1 mol. % to about 30 mol. % of the polymer.
13. The molded interconnect device of claim 10 , wherein the liquid crystalline polymer further contains repeating units derived from terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, hydroquinone, 4,4′-biphenol, acetaminophen, 4-aminophenol, or a combination thereof.
14. The molded interconnect device of claim 1 , wherein the polymer composition exhibits an in-plane thermal conductivity of about 1 W/m-K or more as determined in accordance with ASTM E1461-13 and/or a through-plane thermal conductivity of about 0.2 W/m-K or more as determined in accordance with ASTM E1461-13.
15. The molded interconnect device of claim 1 , wherein the mineral filler contains mineral particles.
16. The molded interconnect device of claim 15 , wherein the mineral particles include talc, mica, silica, or a combination thereof.
17. The molded interconnect device of claim 1 , wherein the mineral filler contains mineral fibers.
18. The molded interconnect device of claim 17 , wherein the mineral fibers include wollastonite.
19. The molded interconnect device of claim 17 , wherein the mineral fibers have a median length of from about 40 to about 220 micrometers.
20. The molded interconnect device of claim 17 , wherein the mineral fibers have an aspect ratio of from about 2 to about 50.
21. The molded interconnect device of claim 1 , wherein the polymer composition has a melt viscosity of from about 10 to about 250 Pa-s, as determined in accordance with ISO Test No. 11443:2014 at a shear rate of 1,000 s −1 and temperature that is 15° C. above the melting temperature of the composition.
22. The molded interconnect device of claim 1 , wherein the conductive elements comprise a metal.
23. The molded interconnect device of claim 1 , wherein channels are formed in the substrate in the form of an interconnect pattern, and wherein the conductive elements are disposed within the channels.
24. The molded interconnect device of claim 23 , wherein the conductive elements include a first metal layer and a second metal layer.